LVDS Transceiver in TSMC 28nm

Overview

A 2Gbps LVDS Tranceiver in TSMC 28nm

This 1.8V LVDS transceiver, designed for TSMCs 28nm process, delivers high-speed, low-power differential signaling with superior signal integrity. Engineered with 1.8V thick oxide devices and a 0.8V standard core interface, it operates ef- ficiently across a wide temperature range (-40°C to 125°C). The transceiver supports data rates up to 2Gbps, offering low jitter, robust ESD protection (+2kV HBM, +500V CDM), and integrated on-die termination for enhanced noise immunity. Opti- mized for applications requiring precision and reliability, this LVDS I/O solution ensures clean, high-speed data transmission ideal for imaging systems, communication interfaces, and high-performance computing.

Operating Conditions

Parameter Value
Devices 1.8V Thick and 0.9V Thin Oxides
BEOL 8 Metals Min.
VDDIO 1.8V
VDD 0.8V
Temperature -40C to 125C
ESD +2kV HBM, +500V CDM

Key Features

  •  2Gbps transmit and receive modes
  •  Available 100 ohm on-die termination
  •  Selectable pre-emphasis for high speeds at heavier loads
  •  +2kV HBM & +500V CDM protection
  •  Input and output disable

Block Diagram

LVDS Transceiver in TSMC 28nm Block Diagram

Technical Specifications

Foundry, Node
TSMC 28nm
TSMC
Pre-Silicon: 28nm
×
Semiconductor IP