Tundra Semiconductor Terminates Product Acquisition and License Agreements with IBM
Ottawa, Ontario – June 3, 2008 - Tundra Semiconductor Corporation (Tundra), a leader in System Interconnect, has terminated its product acquisition agreement, announced in August, 2007, with IBM Global Engineering Solutions (IBM), effective June 1, 2008. The acquired product was to be based on an IBM Power Architecture™ 90 nm processor core. IBM recently notified Tundra that the performance of the core is lower than previously stated. Since the IBM core cannot meet the stated performance, the product is now unsuitable for Tundra’s intended target applications and market. In November, 2007, Tundra also signed a license agreement with IBM to bring new 65nm Power Architecture solutions to market as part of Tundra’s smart System Interconnect (sSI) strategy and roadmap. As a result of the decision to terminate the product acquisition agreement, and based on Tundra’s review of the current IBM performance data for the 65nm core, Tundra has also made the decision to terminate that license agreement.
Tundra intends to actively pursue alternative means of executing against its sSI strategy to bring intelligent System Interconnect solutions to broader global markets.
About Tundra
Tundra Semiconductor Corporation (TSX:TUN) supplies the world’s leading communications, computing and storage companies with System Interconnect products, intellectual property (IP) and design services backed by world-class customer service and technical support. Tundra’s track record of product leadership includes over a decade of bridges and switches enabling key industry standards: RapidIO®, PCI, PCI-X, PCI Express®, Power Architecture™, VME, HyperTransport™, Interlaken, and SPI4.2. Tundra’s products deliver high functional quality and simplified board design and layout, with specific focus on system level signal integrity. Tundra's design services division, Silicon Logic Engineering, Inc., offers industry-leading ASIC and FPGA design services, semiconductor intellectual property and product development consulting. Tundra’s technology connects critical components in high performance embedded systems around the world. For more information, please visit www.tundra.com.
Related Semiconductor IP
- 1.8V/3.3V I/O library with ODIO and 5V HPD in TSMC 16nm
- 1.8V/3.3V I/O Library with ODIO and 5V HPD in TSMC 12nm
- 1.8V to 5V GPIO, 1.8V to 5V Analog in TSMC 180nm BCD
- 1.8V/3.3V GPIO Library with HDMI, Aanlog & LVDS Cells in TSMC 22nm
- Specialed 20V Analog I/O in TSMC 55nm
Related News
- Tundra Semiconductor Leads RapidIO Market with Launch of First Commercially Available Products
- Tundra pays $10 million for IBM's PCI-X Bus Bridge product line
- Xilinx RapidIO Solution Successfully Interoperates With Freescale PowerQUICC III Processor & Tundra RapidIO Switch
- Gov'T of Canada Invests $7M In Tundra Semiconductor to Develop Next-Generation RapidIO Technology
Latest News
- Will RISC-V reduce auto MCU’s future risk?
- Frontgrade Gaisler Launches New GRAIN Line and Wins SNSA Contract to Commercialize First Energy-Efficient Neuromorphic AI for Space Applications
- Continuous-Variable Quantum Key Distribution (CV-QKD) system demonstration
- Latest intoPIX JPEG XS Codec Powers FOR-A’s FA-1616 for Efficient IP Production at NAB 2025
- VeriSilicon Launches ISP9000: The Next-Generation AI-Embedded ISP for Intelligent Vision Applications