TTPCom and Matsushita achieve first 3G RFIC silicon meeting 3GPP specification
22 January 2003 - TTPCom Ltd. (LSE: TTC) and Semiconductor Company of Matsushita Electric Industrial Co. (MEI), have reached a significant milestone in achieving functional first silicon of a 3GPP (3rd Generation Partnership Project) transceiver design based on TTPCom technology.
The first devices have been evaluated and shown to meet the specifications set for 3GPP. Full system evaluation is now underway at TTPCom’s testing facilities, with first production samples expected in the second half of 2003.
The TTPCom reference design delivered to MEI was optimised to meet their specific requirements for a 3GPP only transceiver. Development of a dual GSM / 3G transceiver continues, with first silicon expected in mid 2003.
“Bringing together the systems expertise and experience of TTPCom with the silicon design expertise of our team enabled us to reduce development time for the 3G transceiver,” said MEI Product Manager, Hiroyuki Ushihara. He continued, “The cooperation worked very well and TTPCom continues to work with us supporting the discussions we are having with handset manufacturers who are interested in using our RFICs”.
TTPCom’s RFIC core Product Manager, Gerry Stanton said “We are very pleased to see working 3GPP RFICs on the bench. Our teams worked closely to optimise our reference IP to meet the MEI design goals. Seeing working silicon validates our IP, MEI’s circuit design and our model of co-working”.
MEI has a strong background in RF design for systems such as the Japanese PDC (Personal Digital Cellular) system. Their range of RFICs for 2.5 and 3G systems is designed to allow handset partners to implement these technologies with minimal design overhead. The forthcoming dual 3G /GSM RFICs will enable handsets that are capable of operating with 2G /2.5G and 3G networks, allowing subscribers seamless access to different networks as the world’s cellular operators roll out new 3G services. This capability could be vital to the successful introduction of 3G services as it is unlikely that today’s subscribers will be prepared to tolerate any loss of service when they move to areas only covered by 2 and 2.5G systems.
Related Semiconductor IP
- AES GCM IP Core
- High Speed Ethernet Quad 10G to 100G PCS
- High Speed Ethernet Gen-2 Quad 100G PCS IP
- High Speed Ethernet 4/2/1-Lane 100G PCS
- High Speed Ethernet 2/4/8-Lane 200G/400G PCS
Related News
- TTPCom's software is first portable 3G protocol stack to achieve full GCF and IOT accreditation
- TTPCom announces complete technology suite for the development of 3G terminals
- TTPCom and ARM colloborate on complete IP Platforms for Multimode, 3G Baseband Designs
- TTPCom's AJAR 3G to dramatically accelerate mass-market feature phone development
Latest News
- HPC customer engages Sondrel for high end chip design
- PCI-SIG’s Al Yanes on PCIe 7.0, HPC, and the Future of Interconnects
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- Cadence Unveils Arm-Based System Chiplet
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers