TSMC to reportedly boost capex, build new fab
EETimes, 12/3/2010 6:22 PM EST
SAN FRANCISCO—Taiwan Semiconductor Manufacturing Co. Ltd. plans to increase its capital spending in 2011 compared to this year and is planning a new 300-mm fab in Taiwan that will open in 2015, according to reports emerging from the company's supply chain management forum.
Morris Chang, TSMC's chairman and CEO, said the foundry would boost capacity by more than 30 percent next year in order to meet customer demand, according to reports by Taipei Times and others. Chang also reportedly said TSMC would increase capital spending in 2011 from a projected $5.9 billion this year, though he declined to provide a number.
To read the full article, click here
Related Semiconductor IP
- NFC wireless interface supporting ISO14443 A and B with EEPROM on SMIC 180nm
- DDR5 MRDIMM PHY and Controller
- RVA23, Multi-cluster, Hypervisor and Android
- HBM4E PHY and controller
- LZ4/Snappy Data Compressor
Related News
- Foundries to boost capex in 2011
- Analyst: TSMC to boost capex
- UMC to boost 2012 capex to $2 billion
- SmartSoC Solutions Joins TSMC Design Center Alliance to Boost Semiconductor Innovation in India
Latest News
- CAST Releases First Dual LZ4 and Snappy Lossless Data Compression IP Core
- Arteris Wins “AI Engineering Innovation Award” at the 2025 AI Breakthrough Awards
- SEMI Forecasts 69% Growth in Advanced Chipmaking Capacity Through 2028 Due to AI
- eMemory’s NeoFuse OTP Qualifies on TSMC’s N3P Process, Enabling Secure Memory for Advanced AI and HPC Chips
- AIREV and Tenstorrent Unite to Launch Advanced Agentic AI Stack