TSMC Board Approves Expansion of 45 Nanometer Capacity
Hsinchu, Taiwan, R.O.C., May 8, 2007
– TSMC’s (NYSE: TSM) Board of Directors today approved capital appropriation of US$205 million for expanding 45 nanometer process capacity in Fab 12.
TSMC’s Vice President and Chief Financial Officer, Ms. Lora Ho, said other major conclusions of the Board meeting were as follows:
1. Approved a proposal setting the number of directors of TSMC’s Board of Directors at eight.
2. Approved a capital increase to reflect the issuance of 3,271,373 new TSMC common shares as a result of employees exercising their stock options, and set May 15, 2007 as the record date for the capital increase.
Related Semiconductor IP
- Root of Trust (RoT)
- Fixed Point Doppler Channel IP core
- Multi-protocol wireless plaform integrating Bluetooth Dual Mode, IEEE 802.15.4 (for Thread, Zigbee and Matter)
- Polyphase Video Scaler
- Compact, low-power, 8bit ADC on GF 22nm FDX
Related News
- IBM and Chartered Extend Technology Development Agreement to 45 Nanometer
- QUALCOMM Begins Utilizing 45 Nanometer Semiconductor Process Technology
- Texas Instruments new process techniques solve low-power challenges in delivering company's first 45 nanometer wireless device
- Samsung and Intrinsity Jointly Develop the World's Fastest ARM Cortex-A8 Processor Based Mobile Core in 45 Nanometer Low Power Process
Latest News
- BrainChip Provides Low-Power Neuromorphic Processing for Quantum Ventura’s Cyberthreat Intelligence Tool
- Ultra Accelerator Link Consortium (UALink) Welcomes Alibaba, Apple and Synopsys to Board of Directors
- CAST to Enter the Post-Quantum Cryptography Era with New KiviPQC-KEM IP Core
- InPsytech Announces Finalization of UCIe IP Design, Driving Breakthroughs in High-Speed Transmission Technology
- Arm Announces Appointment of Eric Hayes as Executive Vice President, Operations