TSMC Adds New High Voltage Features to Advanced 0.13-micron Processes Aimed at High Resolution Display Drivers
Hsinchu, Taiwan, R.O.C. -- November 5, 2008
- TSMC (TSE: 2330, NYSE: TSM) has enhanced its 0.13um process technology with immediate availability of a 1.5/6/32V technology, targeted at high resolution mobile handset display drivers.
The high-yield process features an Aluminum Copper (AlCu) backend metal scheme and is designed to meet energy reduction targets, while responding to the marketâs demand for smaller line width options, reducing die size in next-generation high-resolution display driver ICs.
The growing popularity of mobile TV and internet browsing demands a new generation of portable displays that feature high resolution and excellent power performance. The new 1.5/6/32V technology cuts die size requirements for new high-resolution mobile handset display drivers, while providing the high drive voltages required at the smaller 0.13um geometry.
TSMCâs new process is particularly compact and provides the smallest SRAM bit cell of any commercial foundry, at no compromise to speed and stand-by power. It also adds the necessary core voltage under-drive range, at 1.2V, to meet the most stringent green panel requirements. Furthermore innovative new fuse implementations simplify display optimization and matching during production testing.
About TSMC
TSMC is the worldâs largest dedicated semiconductor foundry, providing the industryâs leading process technology and the foundryâs largest portfolio of process-proven libraries, IP, design tools and reference flows. The Companyâs total managed capacity in 2008 is to exceed nine million (8-inch equivalent) wafers, including capacity from two advanced 12-inch Gigafabs, four eight-inch fabs, one six-inch fab, as well as TSMCâs wholly owned subsidiaries, WaferTech and TSMC (Shanghai), and its joint venture fab, SSMC. TSMC is the first foundry to provide 40nm production capabilities. Its corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC please see http://www.tsmc.com.
Related Semiconductor IP
- NPU IP Core for Mobile
- NPU IP Core for Edge
- Specialized Video Processing NPU IP
- HYPERBUS™ Memory Controller
- AV1 Video Encoder IP
Related News
- Cadence AI-Powered Virtuoso Studio Supports RF and mmWave Design Reference Flows for TSMC N16RF, N6RF and N4PRF
- Analog Bits to Demonstrate Automotive Grade IP's Including a Novel High Accuracy Sensor at TSMC 2023 North America Open Innovation Platform Ecosystem Forum
- Siemens and TSMC collaborate to help mutual customers optimize designs using foundry's newest advancements
- Synopsys and TSMC Streamline Multi-Die System Complexity with Unified Exploration-to-Signoff Platform and Proven UCIe IP on TSMC N3E Process
Latest News
- Jim Keller: ‘Whatever Nvidia Does, We’ll Do The Opposite’
- FlexGen Streamlines NoC Design as AI Demands Grow
- IntoPIX Presents Its New Titanium Software Suite: Empowering AV-Over-IP Workflows With Speed, Quality & Interoperability
- Global Semiconductor Sales Increase 2.5% Month-to-Month in April
- Speedata Raises $44M to Launch First-Ever Chip Designed Specifically for Accelerating Big Data Analytics - Compute's Second Largest Workload