Truechip announces first customer shipment of DDR3 and DDR4 Verification IPs
December 2, 2014 - Truechip Solutions, the verification IP specialist, announced that it has released early adopter versions of its DDR3 and DDR4 VIPs to its partners in the early adoption program.
These VIPs are natively developed in SystemVerilog (UVM) and come with assertions that support dynamic simulation as well as formal verification.
Both VIPs provide 100% functional coverage and are compatible with industry leading simulators and emulators.
Nitin Kishore, CEO of Truechip, said in a statement, "2014 has been a very successful year for us. We shipped industry's first USB3.1 Verification IP in February 2014, and during the course of the year, this VIP has seen tremendous customer interest and demand. As we prepare for an even stronger 2015, we want to further expand our product portfolio, and this release of DDR3 and DDR4 VIPs, is the first of many other new and exciting product releases that we will be shipping to our customers over the next few months.”
To try out any of Truechip's high quality VIPs or experience industry's first 24X5 support, please visit www.truechip.net.
Related Semiconductor IP
- Rad-Hard GPIO, ODIO & LVDS in SkyWater 90nm
- 1.22V/1uA Reference voltage and current source
- 1.2V SLVS Transceiver in UMC 110nm
- 1.8V/3.3V GPIO With I2C Compliant ODIO in GF 55nm
- Verification IP for UALink
Related News
- Truechip: Exhibiting and Showcasing Latest Verification IPs and NOC IPs at Design Automation Conference (DAC) 2023
- Uniquify to Present High-Performance DDR3 Memory System in Low-Cost Wire Bond Package, Fastest DDR4 Memory IP at CSIA-ICCAD 2014 in Hong Kong
- Truechip announces first customer shipment of LPDDR3 and LPDDR4 Comprehensive Verification IPs
- Truechip to demonstrate next generation Comprehensive Verification IPs at DAC 2015
Latest News
- EXTOLL received GlobalFoundries Award for “Interface IP Partner of the Year”
- AiM Future and Franklin Wireless Sign MOU to Jointly Develop Lightweight AI Model and High-Efficiency 1 TOPS AI SoC Chipset
- GlobalFoundries and Silicon Labs Partner to Scale Industry-Leading Wi-Fi Connectivity
- GlobalFoundries Announces Availability of 22FDX+ RRAM Technology for Wireless Connectivity and AI Applications
- GlobalFoundries Announces Production Release of 130CBIC SiGe Platform for High-Performance Smart Mobile, Communication and Industrial Applications