Three customers, STMicroelectronics, ARM Ltd. and Sony Corp. invest in CoWare
Three customers invest in CoWare
By Richard Goering, EE Times
August 7, 2000 (3:32 p.m. EST)
URL: http://www.eetimes.com/story/OEG20000731S0021
SANTA CLARA, Calif. CoWare Inc., a provider of hardware/software co-design tools, has received a combined $14 million in equity investments from STMicroelectronics, ARM Ltd. and Sony Corp. The investment, which is unusually large for a small EDA company, comes on top of another $14 million received by CoWare in two previous venture financing rounds. All three of the new investors are longtime CoWare customers or partners, and each will take an undisclosed equity share in the company. The previous investors were venture capital firms, including Greylock, Needham & Co.; GIMV; and IT Partners. CoWare chief executive Guido Arnout said the latest funding will be used to expand the company's sales channel. "We have worked in a very focused way with a limited set of customers," he said. "We need to expand to new customers." CoWare provides N2C, a tool suite that allows C language design, high-level simulation, hardware/software partitioning and synthesis of the "interface" hardware and software needed to connect logic blocks. Alain Duthell, corporate vice president for strategic planning at STMicroelectronics, said his company has reduced the time required to create a system platform to six months from 24 months using N2C. CoWare is privately held and employs around 120 people. Other major CoWare customers include Motorola, Nokia and Alcatel.
Related Semiconductor IP
- AES GCM IP Core
- High Speed Ethernet Quad 10G to 100G PCS
- High Speed Ethernet Gen-2 Quad 100G PCS IP
- High Speed Ethernet 4/2/1-Lane 100G PCS
- High Speed Ethernet 2/4/8-Lane 200G/400G PCS
Related News
- STMicroelectronics, ARM and Cadence Improve Tool and Model Interoperability with Three Joint Contributions to Accellera Systems Initiative
- Adesto Joins STMicroelectronics Partner Program to Accelerate Time-to-Market for Customers
- Siemens expand collaboration with AWS to help IC and electronics design customers accelerate innovation
- Global Semiconductor Industry Plans to Invest $400 Billion in 300mm Fab Equipment Over Next Three Years, SEMI Reports
Latest News
- HPC customer engages Sondrel for high end chip design
- PCI-SIG’s Al Yanes on PCIe 7.0, HPC, and the Future of Interconnects
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- Cadence Unveils Arm-Based System Chiplet
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers