ST increases outsourcing, denies fab-lite strategy
(05/24/2006 6:54 AM EDT)
URL: http://www.eetimes.com/showArticle.jhtml?articleID=188101947
LONDON â Leading European chipmaker STMicroelectronics has taken the proportion of advanced CMOS logic that it puts out to foundry above 50 percent, the company told a meeting of financial analystsâ held here Tuesday (May 23). However, the company denied it was adopting a fab-lite strategy or that it was putting itself at risk of being unable to supply customers due to manufacturing shortages.
In the first quarter of 2006 53 percent of STâs advanced CMOS logic wafers &151; defined by ST to be 0.13-micron and more advanced manufacturing processes â were processed externally. This figure was compared with 42 percent made externally in the first quarter of 2005. By the fourth quarter of 2006 ST intends to increase the proportion of external manufacture to about 59 percent while it projects that the volume of advanced CMOS logic wafers it requires will have doubled from Q1 2006.
As the proportion of outsourcing was revealed ST was challenged from the floor as to whether the company had turned a corner and followed the likes of Philips Semiconductor and Freescale Semiconductor into a so-called âfab-liteâ strategy.
âWe donât have a fab-lite strategy,â said Alain Dutheil, chief operating officer of ST, in response. âWhen we can we go to foundry.â
To read the full article, click here
Related Semiconductor IP
- Post-Quantum Digital Signature IP Core
- Compact Embedded RISC-V Processor
- Power-OK Monitor
- RISC-V-Based, Open Source AI Accelerator for the Edge
- Securyzr™ neo Core Platform
Related News
- TSMC 6-inch Wafer Fab Exit Affirms Strategy Shift
- ST lays out strategy for analysts in HK
- Apple Increases Tablet Market Share to 34 percent in Q4 2013, as Global Tablet Market Grows 33 percent in 2013
- SkyWater to Acquire Infineon’s Austin Fab and Establish Strategic Partnership to Expand U.S. Foundry Capacity for Foundational Chips
Latest News
- CAST Simplifies RISC-V Embedded Processor IP Adoption with New Catalyst Program
- Arm vs. RISC-V: Same DNA, Different Flight Paths
- How EdgeQ Is Building India’s First Unified 5G + AI SoC
- UMC Introduces 55nm BCD Platform to Elevate Power Efficiency for Smartphones, Consumer Electronics, and Automotive Applications
- SmartDV Announces Multiple Customer Licenses for MIPI® SoundWire® I3S℠ 1.0 IP Portfolio