Strengthening Europe’s Semiconductor Strategy in a Shifting Geopolitical Landscape
“If Europe tries to be a jack of all trades, Europe will become the master of none,” said Hendrik Bourgeois, vice president of European Government Affairs at Intel.
By Anne-Françoise Pelé, EETimes Europe | April 26, 2025
The first three months of President Donald Trump’s second term have had major repercussions on Europe’s technological sector. In his keynote at the recent SEMI Industry Strategy Symposium Europe (ISS Europe) in Sopot, Poland, Hendrik Bourgeois, vice president of European Government Affairs at Intel, called on Europe to face the new geopolitical reality with strategic clarity and industrial focus. For the semiconductor industry, this means relentless innovation, large-scale investment, and strong international collaboration.
“The European Union has not been created, as somebody has said recently, to screw the United States, but to ensure that relations between nations are governed by rules,” Bourgeois said.
To read the full article, click here
Related Semiconductor IP
- NFC wireless interface supporting ISO14443 A and B with EEPROM on SMIC 180nm
- DDR5 MRDIMM PHY and Controller
- RVA23, Multi-cluster, Hypervisor and Android
- HBM4E PHY and controller
- LZ4/Snappy Data Compressor
Related News
- Presto Engineering Receives Venture Funding To Expand its Pioneering Labless Strategy into Europe
- Geopolitical Tensions Fuel a Wave of AI Chip Independence as US and Chinese CSPs Race to Develop In-House ASICs, Redefining the Market Landscape, Says TrendForce
- eASIC Corporation to Employ Numerical Technologies' Phase Shifting to Significantly Boost Performance of Configurable Logic Chips
- Numeritech announces Texas Instruments to license phase shifting technology to support 0.13-micron Process
Latest News
- CAST Releases First Dual LZ4 and Snappy Lossless Data Compression IP Core
- Arteris Wins “AI Engineering Innovation Award” at the 2025 AI Breakthrough Awards
- SEMI Forecasts 69% Growth in Advanced Chipmaking Capacity Through 2028 Due to AI
- eMemory’s NeoFuse OTP Qualifies on TSMC’s N3P Process, Enabling Secure Memory for Advanced AI and HPC Chips
- AIREV and Tenstorrent Unite to Launch Advanced Agentic AI Stack