Solid State System (3S) Standardizes on Tensilica's Xtensa Processor for Future SOC Development; For Use in High-Volume Consumer Applications
Tensilica(R), Inc., the leading provider of configurable and extensible processors, today announced that Solid State System Co., Ltd., of Hsinchu, Taiwan, popularly called 3S, has licensed the Xtensa(R) processor. 3S plans to standardize on Tensilica's Xtensa processor for future system-on-chip (SOC) development, to fulfill the increasing requirements of configurable and reliable processor's performance from leading consumer applications.
"Tensilica proved that the Xtensa processor could be configured for many demanding applications," stated Jeffrey Lin, President of 3S. "As a leading company of Flash memory controller for a variety of applications, we admire the merits of the flexibility of the Xtensa architecture. We plan to base future SOC development on Xtensa."
"Having a full team in Taiwan allowed us to work closely with 3S even during this challenging time with SARS, travel restrictions and global recession," said Bernie Rosenthal, senior vice president of sales and marketing for Tensilica. "We're very pleased that 3S has chosen our processor for their innovative new consumer products, and we look forward to future designs."
About Solid State System
Solid State System Co., Ltd., is headquartered in Hsinchu, Taiwan. 3S has developed a strong reputation as an innovator and leader in flash disks solutions, particularly the controllers of CompactFlash(TM) cards, and smaller "thumb" sized "key chain" USB storage devices, which it markets under its own name and under OEM relationships for other companies. For more information, visit www.3system.com.tw.
About Tensilica
Tensilica was founded in July 1997 to address the growing need for optimized, application-specific microprocessor solutions in high-volume embedded applications. With a configurable and extensible microprocessor core called Xtensa, Tensilica is the only company that has automated and patented the time-consuming process of generating a customized microprocessor core along with a complete software development tool environment, producing new configurations in a matter of hours. For more information, visit www.tensilica.com.
Related Semiconductor IP
- USB 20Gbps Device Controller
- Ultra-High-Speed Time-Interleaved 7-bit 64GSPS ADC on 3nm
- Fault Tolerant DDR2/DDR3/DDR4 Memory controller
- 25MHz to 4.0GHz Fractional-N RC PLL Synthesizer on TSMC 3nm N3P
- AGILEX 7 R-Tile Gen5 NVMe Host IP
Related News
- Cadence and Imperas Support NSITEXE in the Development of Advanced RISC V Vector Processor IP for Automotive AI Applications
- Frontgrade Gaisler Leads the Way in RISC-V Processor Development for Space Applications
- AiM Future Brings GenAI Applications to Mainstream Consumer Devices
- Mirabilis Design Accelerates SoC Development with New System-Level IP Library for Cadence Tensilica Processors
Latest News
- BrainChip Expands Global Reach, Announces Akida Boards and AI Development Kits Available at DigiKey
- Qualitas Semiconductor Successfully Demonstrates Live UCIe PHY IP at AI Infra Summit 2025
- Silicon Creations Announces 1000th Production FinFET Tapeout at TSMC and Immediate Availability of Full IP Library on TSMC N2 Technology
- Intel and NVIDIA to Jointly Develop AI Infrastructure and Personal Computing Products
- Comcores MACsec IP is compliant with the OPEN Alliance Standard