SMIC to Report Tunnel-FET Extension to CMOS
Peter Clarke, EETimes
10/9/2015 09:14 AM EDT
LONDON—Chinese foundry Semiconductor Manufacturing International Corp. has manufactured complementary Tunnel FETs (C-TFETs) that operate at 0.4V using a CMOS baseline technology.
Because of the low voltage operation, SMIC (Shanghai, China) is declaring that the platform has potential for ultra low-power applications such as the Internet of Things (IoT).
The details are due to be revealed at the upcoming International Electron Devices Meeting (IEDM) scheduled to take place at the Washington D.C. Hilton Hotel from December 7 to 9, 2015.
Although the minimum geometry of the process is not revealed in the abstract of the paper, it is one of the more interesting IEDM papers because of suggestions that a TFET process could be relatively near to deployment. The paper was written by researchers from Peking University and SMIC.
To read the full article, click here
Related Semiconductor IP
- NFC wireless interface supporting ISO14443 A and B with EEPROM on SMIC 180nm
- NFC wireless interface supporting ISO14443 A and B on SMIC 180nm
- Power On Reset - SMIC 40nm
- Power On Reset - SMIC 55nm
- Power On Reset - SMIC 40nm
Related News
- Cista Design Inc. Selects Kilopass OTP NVM for Next Generation CMOS Image Sensor on SMIC Independently Developed 130nm Back Side Illumination Technology Platform
- Chipidea Launches New Line of CMOS Radio Frequency IP Platforms
- Avago Advances Its ASIC Technology to the Next Generation: Proves High-Performance 12.5 Gbps SerDes Core in 65 Nm CMOS Process
- Cypress's SVTC Enables Cavendish Kinetics to Develop and Characterize Embedded Non-Volatile Memory Technology for Standard CMOS Processes
Latest News
- CAST Releases First Dual LZ4 and Snappy Lossless Data Compression IP Core
- Arteris Wins “AI Engineering Innovation Award” at the 2025 AI Breakthrough Awards
- SEMI Forecasts 69% Growth in Advanced Chipmaking Capacity Through 2028 Due to AI
- eMemory’s NeoFuse OTP Qualifies on TSMC’s N3P Process, Enabling Secure Memory for Advanced AI and HPC Chips
- AIREV and Tenstorrent Unite to Launch Advanced Agentic AI Stack