Samsung Running 28nm FDSOI Chip Process
Peter Clarke, EETimes
12/23/2015 11:30 AM EST
The report is in the form of an interview with Kelvin Low senior director of marketing for Samsung Foundry and Axel Foscher, director of Samsung System LSI business in Europe. Soitec SA, the manufacturer of SOI wafers used in FDSOI production, is the publisher of Advanced Substrate News.
To read the full article, click here
Related Semiconductor IP
- Ultra-Low-Power LPDDR3/LPDDR2/DDR3L Combo Subsystem
- 1G BASE-T Ethernet Verification IP
- Network-on-Chip (NoC)
- Microsecond Channel (MSC/MSC-Plus) Controller
- 12-bit, 400 MSPS SAR ADC - TSMC 12nm FFC
Related News
- DEEPX Signs 2nm Process Agreement with Samsung Foundry to Develop World’s First On-Device Generative AI Chip ‘DX-M2’
- Samsung and STMicroelectronics Sign Strategic Agreement to Expand 28nm FD-SOI Technology
- Cadence Announces Availability of IP Solutions on 28nm FD-SOI Process
- Synopsys, STMicroelectronics and Samsung Collaborate to Accelerate Adoption of 28-nm FD-SOI Technology for SoC Design
Latest News
- Virtusa Acquires Bengaluru based SmartSoC Solutions, Establishing Full-Stack Service Offering from Chip to Cloud and Driving Expansion into the Semiconductor Industry
- Consumer Electronics and AI Product Launches Lift 3Q25 Top-10 Foundry Revenue by 8.1%, Says TrendForce
- Joachim Kunkel Joins Quadric Board of Directors
- RaiderChip NPU leads edge LLM benchmarks against GPUs and CPUs in academic research paper
- SEMIFIVE Secures AI Semiconductor Design Projects in Japan, Accelerating Global Expansion with New Local Subsidiary