Qualcomm Technologies announces new specs for ARM-based data-center SoC
October 12, 2015 -- On Thursday, Qualcomm Technologies announced early specs for a new ARM-based data center system on a chip (SoC), expanding beyond mobile chips into server processors for the first time. It’s one of the most advanced server processors, and could be a low-power alternative.
Over the years, server processors have consolidated in the hands of a couple of heavyweights, so competition could do the industry some good. Qualcomm Technologies' server SoC technology can support a variety of data center needs, including infrastructure-as-a-service, platform-as-a service, big data, and machine learning, which are increasingly ingrained in the server computer world. High-performance processors are necessary to support the intense pressure on cloud infrastructure and the movement to hyperscale data centers.
Qualcomm Technologies envisions the cloud evolving from silos to a more integrated cloud infrastructure by 2020, and this announcement is a step in that direction.
Related Semiconductor IP
- Rad-Hard GPIO, ODIO & LVDS in SkyWater 90nm
- 1.22V/1uA Reference voltage and current source
- 1.2V SLVS Transceiver in UMC 110nm
- 1.8V/3.3V GPIO With I2C Compliant ODIO in GF 55nm
- Verification IP for UALink
Related News
- Qualcomm Datacenter Technologies Announces Commercial Shipment of Qualcomm Centriq 2400 - The World's First 10nm Server Processor and Highest Performance Arm-based Server Processor Family Ever Designed
- Qualcomm Begins Commercial Sampling of World's First 10nm Server Processor and Reshapes the Future of Datacenter Computing
- Rambus Validates Interoperability of DDR4 High-performance Memory IP Solution for Arm-based Datacenter Systems
- Qualcomm reported to be dumping Arm-based server chips
Latest News
- EXTOLL received GlobalFoundries Award for “Interface IP Partner of the Year”
- AiM Future and Franklin Wireless Sign MOU to Jointly Develop Lightweight AI Model and High-Efficiency 1 TOPS AI SoC Chipset
- GlobalFoundries and Silicon Labs Partner to Scale Industry-Leading Wi-Fi Connectivity
- GlobalFoundries Announces Availability of 22FDX+ RRAM Technology for Wireless Connectivity and AI Applications
- GlobalFoundries Announces Production Release of 130CBIC SiGe Platform for High-Performance Smart Mobile, Communication and Industrial Applications