PCI Express takes on Thunderbolt
Rick Merritt, EETimes
6/22/2011 6:06 PM EDT
SANTA CLARA, Calif. – The PCI Special Interest Group will launch an effort in July to created a cabled version of PCI Express that will take on the Thunderbolt interconnect developed by Intel and Apple. Backers suggest the PCIe approach will be more open and more optimal than Thunderbolt for delivering high throughput I/O to tablets and thin notebooks.
The new cable will be based on PCIe 3.0 which supports up to 8 GTransfers/second. It likely will support a maximum of four parallel lanes for throughput up to 32 Gbits/s and distances no longer than three meters.
To read the full article, click here
Related Semiconductor IP
- ISO/IEC 7816 Verification IP
- 50MHz to 800MHz Integer-N RC Phase-Locked Loop on SMIC 55nm LL
- Simulation VIP for AMBA CHI-C2C
- Process/Voltage/Temperature Sensor with Self-calibration (Supply voltage 1.2V) - TSMC 3nm N3P
- USB 20Gbps Device Controller
Related News
- Mobiveil, Inc. and M31 Technology Announce A Compliant PCI Express PHY and Controller Solution
- Truechip announces first customer shipment of PCI Express Gen3 Comprehensive Verification IP (CVIP)
- Mobiveil Teams With Semtech to Provide SoC Designers a Verified PCI Express(R) 3.0 Controller and PCI Express 3.0 PHY IP Solution
- Cadence Achieves First PCI Express 2.0 and PCI Express 3.0 Compliance for TSMC 16nm FinFET Plus Process
Latest News
- Quintauris and Andes Technology Partner to Scale RISC-V Ecosystem
- Europe Achieves a Key Milestone with the Europe’s First Out-of-Order RISC-V Processor chip, with the eProcessor Project
- Intel Unveils Panther Lake Architecture: First AI PC Platform Built on 18A
- TSMC September 2025 Revenue Report
- Andes Technology Hosts First-Ever RISC-V CON in Munich, Powering Next-Gen AI and Automotive Solutions