PCI Express takes on Thunderbolt
Rick Merritt, EETimes
6/22/2011 6:06 PM EDT
SANTA CLARA, Calif. – The PCI Special Interest Group will launch an effort in July to created a cabled version of PCI Express that will take on the Thunderbolt interconnect developed by Intel and Apple. Backers suggest the PCIe approach will be more open and more optimal than Thunderbolt for delivering high throughput I/O to tablets and thin notebooks.
The new cable will be based on PCIe 3.0 which supports up to 8 GTransfers/second. It likely will support a maximum of four parallel lanes for throughput up to 32 Gbits/s and distances no longer than three meters.
To read the full article, click here
Related Semiconductor IP
- 1.8V/3.3V I/O library with ODIO and 5V HPD in TSMC 16nm
- 1.8V/3.3V I/O Library with ODIO and 5V HPD in TSMC 12nm
- 1.8V to 5V GPIO, 1.8V to 5V Analog in TSMC 180nm BCD
- 1.8V/3.3V GPIO Library with HDMI, Aanlog & LVDS Cells in TSMC 22nm
- Specialed 20V Analog I/O in TSMC 55nm
Related News
- NVM Express Delivers 1.2 Specification with New Data Center and Client Features for PCI Express Solid-State Drives
- Mobiveil, Inc. and M31 Technology Announce A Compliant PCI Express PHY and Controller Solution
- Truechip announces first customer shipment of PCI Express Gen3 Comprehensive Verification IP (CVIP)
- Mobiveil Teams With Semtech to Provide SoC Designers a Verified PCI Express(R) 3.0 Controller and PCI Express 3.0 PHY IP Solution
Latest News
- Will RISC-V reduce auto MCU’s future risk?
- Frontgrade Gaisler Launches New GRAIN Line and Wins SNSA Contract to Commercialize First Energy-Efficient Neuromorphic AI for Space Applications
- Continuous-Variable Quantum Key Distribution (CV-QKD) system demonstration
- Latest intoPIX JPEG XS Codec Powers FOR-A’s FA-1616 for Efficient IP Production at NAB 2025
- VeriSilicon Launches ISP9000: The Next-Generation AI-Embedded ISP for Intelligent Vision Applications