No new CTO for ARC, more emphasis on software
No new CTO for ARC, more emphasis on software
By Chris Edwards, EE Times UK
March 15, 2002 (6:50 a.m. EST)
URL: http://www.eetimes.com/story/OEG20020315S0005
ARC International will not appoint a chief technical officer (CTO) to replace Keith Diefendorff, who left to join competitor MIPS Technologies at the beginning of this year. Instead, as part of a move that has seen the company recruit a substantially new and US-based management team, ARC plans to add a US-based engineering manager in the near future. Mike Gulett, ARC's CEO, joined from Virata earlier this year and is based in the US himself. He says the CTO role has been eliminated. "All of the new execs are US-based. We will appoint a vice-president of worldwide engineering in 60 days," he told EETimes. Gulett says the choice of a US base for the company's engineering head will have no bearing on its UK operation at Elstree. "Half of our engineers are in North America. The other half are in the UK at Elstree. Elstree is a very important engineering centre for us," said Gulett. More emphasis on softw are As part of the company's plan to combine its hardware and software product lines under the ARC name, it is putting more emphasis on software development for a series of bundled hardware core and software tools products for vertical markets. "We intend to deliver targeted configurations of the software," Gulett said. "About half our engineers work on the processor [hardware] and we don't see that changing. We will be bringing in protocol stacks through partnerships as well as internal development." Farzad Zarrinfar, vice-president of marketing, said: "We will provide customers with a platform, a software stack, an RTOS and the integration."
Related Semiconductor IP
- Rad-Hard GPIO, ODIO & LVDS in SkyWater 90nm
- 1.22V/1uA Reference voltage and current source
- 1.2V SLVS Transceiver in UMC 110nm
- 1.8V/3.3V GPIO With I2C Compliant ODIO in GF 55nm
- Verification IP for UALink
Related News
- Siemens’ Solido SPICE now certified for multiple leading-edge Samsung Foundry processes
- oneNav Unveils World’s First L5-direct™ ASIC, Delivering More Than an Order of Magnitude Improvement in Jamming Resilience for Positioning and Timing, Leveraging GlobalFoundries’ 22FDX® Process Node
- Siemens collaborates with Samsung Foundry on advanced node product certifications and EDA innovation
- Consumer-Tech Brand, Nothing, Taps Ceva’s RealSpace Software to Bring Immersive Spatial Audio to Headphones and Earbuds
Latest News
- EXTOLL received GlobalFoundries Award for “Interface IP Partner of the Year”
- AiM Future and Franklin Wireless Sign MOU to Jointly Develop Lightweight AI Model and High-Efficiency 1 TOPS AI SoC Chipset
- GlobalFoundries and Silicon Labs Partner to Scale Industry-Leading Wi-Fi Connectivity
- GlobalFoundries Announces Availability of 22FDX+ RRAM Technology for Wireless Connectivity and AI Applications
- GlobalFoundries Announces Production Release of 130CBIC SiGe Platform for High-Performance Smart Mobile, Communication and Industrial Applications