NEC Electronics, Sony, and Toshiba Announce Joint Development of 45-nanometer System LSI Process Technologies
TOKYO, February 1, 2006
-- NEC Electronics Corporation, Sony Corporation, and Toshiba Corporation today announced that the companies have agreed to jointly develop system LSI process technologies for the 45-nanometer (nm) generation.
As applications in the digital consumer, mobile, and communications arenas evolve, there are greater requirements for advanced system LSI technologies to achieve higher performance and functionality, such as high-speed data processing, as well as lower power consumption and smaller chip dimensions. The miniaturization of process technology to meet these requirements is becoming increasingly critical and complex.
Meeting these requirements for leading edge system LSI process technology development requires a tremendous investment of development resources. Many semiconductor companies worldwide are working together with the goal of more efficient development.
In February 2004, Sony and Toshiba announced their collaboration on 45-nm system LSI process technology development, and have since proceeded with technology development based at Toshiba's Advanced Microelectronics Center in Yokohama, Japan. The results of their efforts have been reported and recognized at industry symposia. Likewise, NEC Electronics and Toshiba announced their agreement to jointly develop 45-nm process technology in November 2005, and have been in discussions to decide the details of that collaboration.
As a result of today's agreement, NEC Electronics' 45-nm development team will join Sony and Toshiba's ongoing work on 45-nm technology development at the Advanced Microelectronics Center. By combining the three companies' development resources, NEC Electronics, Sony, and Toshiba will raise development efficiency and further accelerate the pace of development, with the aim of establishing 45-nm system LSI process technology quickly.
About NEC Electronics
NEC Electronics Corporation (TSE: 6723) specializes in semiconductor products encompassing advanced technology solutions for the high-end computing and broadband networking markets, system solutions for the mobile handsets, PC peripherals, automotive and digital consumer markets, and multi-market solutions for a wide range of customer applications. NEC Electronics Corporation has 26 subsidiaries worldwide including NEC Electronics America, Inc. (www.am.necel.com) and NEC Electronics (Europe) GmbH (www.eu.necel.com). For additional information about NEC Electronics worldwide, visit www.necel.com.
About Sony Corporation
Sony Corporation is a leading manufacturer of audio, video, game, communications, key device and information technology products for the consumer and professional markets. With its music, pictures, computer entertainment and on-line businesses, Sony is uniquely positioned to be the leading personal broadband entertainment company in the world. Sony recorded consolidated annual sales of approximately $67 billion for the fiscal year ended March 31, 2005. Sony Global Web Site: http://www.sony.net
About Toshiba Corporation
Toshiba Corporation is a leader in the development and manufacture of electronic devices and components, information and communication systems, digital consumer products and power systems. The company's ability to integrate wide-ranging capabilities, from hardware to software and services, assure its position as an innovator in diverse fields and many businesses. In semiconductors, Toshiba continues to promote its leadership in the fast growing system LSI market and to build on its world-class position in NAND flash memories, analog devices and discrete devices. Visit Toshiba's website at www.toshiba.co.jp/index.htm
Related Semiconductor IP
- 6-bit, 12 GSPS Flash ADC - GlobalFoundries 22nm
- LunaNet AFS LDPC Encoder and Decoder IP Core
- ReRAM NVM in DB HiTek 130nm BCD
- UFS 5.0 Host Controller IP
- PDM Receiver/PDM-to-PCM Converter
Related News
- Toshiba, Sony and NEC Electronics Unveil Mass Production Platform Technology for 45nm Generation High Performance System LSI
- Toshiba and NEC Electronics Announce Joint Development of 32-nanometer System LSI Process Technology
- Synopsys Launches Electronics Digital Twin Platform to Accelerate Physical AI System Development
- IBM and Chartered Extend Technology Development Agreement to 45 Nanometer
Latest News
- Seligman Ventures Leads Cognichip’s $60M Series A to Back Physics-Informed AI for Chip Design, Intel CEO Lip-Bu Tan and Seligman Ventures’ Umesh Padval Join the Board
- SEMI Projects Double-Digit Growth in Global 300mm Fab Equipment Spending for 2026 and 2027
- Intel to Repurchase 49% Equity Interest in Ireland Fab Joint Venture
- AGI CPU: Arm’s $100B AI Silicon Tightrope Walk Without Undermining Its Licensees
- EnSilica selected for UK CHERI Adoption Collective