LSI Logic Demonstrates 12 Gbit/S Serial Interface Circuitry in 90 Nanometer Process Technology
- Increases bandwidth by 400 percent over commonly used SerDes interfaces
- Easy integration into high speed SerDes cores in LSI Logic cell-based ASIC or RapidChip Platform ASIC designs
MILPITAS, Calif., June 14, 2004 -- LSI Logic Corporation (NYSE: LSI) today announced it has tested and validated 12 Gbit/s high-speed serial interface circuits in its G90TM 90-nanometer process technology. LSI Logics G90-based 12 Gbit/s interface technology enables serializer/deserializer (SerDes) cores with quadruple the bandwidth of existing backplanes and double the speed of planned 6 Gbit/s backplane upgrades. This industry-leading solution is designed to meet the requirements of the emerging Optical Internetworking Forum (OIF) CEI 11 LR (Long Reach) standard and provides a leap in performance for storage systems, networking, and telecommunications applications.
With our demonstrated 12 Gbit/s serial interface technology, LSI Logic provides an easy path to increase system bandwidth so that our leading ASIC and RapidChipTM Platform ASIC customers can differentiate their high-speed datacom, telecom, and storage systems designs, said Jean Bou-Farhat, vice president, CoreWare, LSI Logic. We continue to push the leading edge of technology in order to meet customers requirements for time-to-market, performance, reliability and flexibility.
In developing 12 Gbit/s serial interface technology, LSI Logic leveraged its extensive experience in high speed SerDes cores which support a range of applications from 155 Mbit/s SONET traffic to 6.4 Gbit/s backplane links. To achieve these breakthroughs with high-speed SerDes technology in 90 nanometer nodes, the companys high speed mixed signal engineers and packaging engineers worked closely together to provide a system solution with robust signal integrity, a necessary requirement for today's high-speed interfaces.
About CoreWare
The LSI Logic CoreWareTMIP library provides the industrys most comprehensive set of IP solutions that are of proven quality and are designed to work seamlessly with the standard-cell ASIC and RapidChipTM Platform ASIC design flows. Customers can leverage CoreWare IP solutions to significantly reduce risk and turn-around times with complex SoC designs. A dedicated worldwide IP support organization is available to assist customers in all aspects of CoreWare SoC design.
About LSI Logic Corporation
LSI Logic Corporation (NYSE: LSI) is a leading designer and manufacturer of communications, consumer and storage semiconductors for applications that access, interconnect and store data, voice and video. In addition, the company supplies storage network solutions for the enterprise. LSI Logic is headquartered at 1621 Barber Lane, Milpitas, CA 95035. http://www.lsilogic.com.
Related Semiconductor IP
- NFC wireless interface supporting ISO14443 A and B with EEPROM on SMIC 180nm
- DDR5 MRDIMM PHY and Controller
- RVA23, Multi-cluster, Hypervisor and Android
- HBM4E PHY and controller
- LZ4/Snappy Data Compressor
Related News
- Agere Systems Demonstrates Fastest SerDes Circuitry Utilizing 90 Nanometer Low-K Technology
- M31 demonstrates high-speed interface IP development achievements on TSMC's 7nm & 5nm process technologies
- M31's 12nm GPIO IP Adopted by C*Core Technology, Powering Innovation in Advanced Process Automotive Chips
- Agere Systems Announces Comprehensive 90 Nanometer Custom Chip Platform Targeted for Communications Applications
Latest News
- CAST Releases First Dual LZ4 and Snappy Lossless Data Compression IP Core
- Arteris Wins “AI Engineering Innovation Award” at the 2025 AI Breakthrough Awards
- SEMI Forecasts 69% Growth in Advanced Chipmaking Capacity Through 2028 Due to AI
- eMemory’s NeoFuse OTP Qualifies on TSMC’s N3P Process, Enabling Secure Memory for Advanced AI and HPC Chips
- AIREV and Tenstorrent Unite to Launch Advanced Agentic AI Stack