InterDigital Responds to Reports of Huawei European Commission Complaint
KING OF PRUSSIA, Pa.-- May 25, 2012-- InterDigital, Inc. (NASDAQ: IDCC) issued the following response to the announcement by Huawei that they filed a complaint with the European Commission, claiming abuse of patents essential to the 3G (UMTS) standard:
"InterDigital has not seen the complaint that was filed, so we can offer no specific response to whatever issues might be raised in the complaint," said Lawrence Shay, President of InterDigital's patent holding subsidiaries. "InterDigital has over 200 engineers in four research and development facilities, and participates with engineers from a broad range of industry leaders in developing and testing innovative technologies that become wireless standards. We have in the past licensed, and continue to license, technologies on the terms set forth in our commitments to those standards bodies. Our long and successful track record of licensing more than 50 companies throughout the mobile industry is proof of that commitment, and of our ability to reach mutually agreeable terms for such licenses."
Over the past three decades, InterDigital's R&D team has developed fundamental wireless technologies that have shaped the cellular industry, and has built a portfolio of over 19,500 patents and patent applications as of December 31, 2011.
About InterDigital®
InterDigital develops fundamental wireless technologies that are at the core of mobile devices, networks, and services worldwide. We solve many of the industry's most critical and complex technical challenges, inventing solutions for more efficient broadband networks and a richer multimedia experience years ahead of market deployment. InterDigital has licenses and strategic relationships with many of the world's leading wireless companies.
Related Semiconductor IP
- xSPI Multiple Bus Memory Controller
- MIPI CSI-2 IP
- PCIe Gen 7 Verification IP
- WIFI 2.4G/5G Low Power Wakeup Radio IP
- Radar IP
Related News
- InterDigital Files Complaint Against Nokia, Huawei and ZTE With International Trade Commission
- InterDigital Files New Complaint Against Huawei, Nokia, Samsung and ZTE with U.S. International Trade Commission
- Infineon Introduces Complete UMTS Handset Platform Solution Development Time and Costs Savings for 3G Handsets of up to 50 Percent
- Cellular3G Integrates CEVA-X DSP Core Into UMTS Baseband Chip for 3G Mobile Phone Applications
Latest News
- Premier ASIC and SoC Design Partner, Sondrel, Rebrands as Aion Silicon
- Intel Financial Risks, Layoffs, Foundry Ambitions
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
- China Takes the Lead in RF Front-End Patent Activity: RadRock and Others Surge Behind Murata
- Arteris Wins Two Gold and One Silver Stevie® Awards in the 2025 American Business Awards®