Intel Explores Foundry Alliance with Samsung in High-Level Talks
By Trendforce (October 22, 2024)
According to a report by the Maeil Business Newspaper, U.S. semiconductor giant Intel has reached out to Samsung Electronics to explore the possibility of forming a foundry alliance.
Citing sources in the semiconductor industry, the report reveals that a senior Intel executive recently requested a high-level meeting between the two companies. Intel’s CEO, Pat Gelsinger, is reportedly seeking a direct meeting with Samsung Electronics Chairman Lee Jae-yong to discuss comprehensive cooperation plans for their foundry divisions.
To read the full article, click here
Related Semiconductor IP
- PUF-based Post-Quantum Cryptography (PQC) Solution
- OPEN Alliance TC14 10BASE-T1S Topology Discovery IP
- HBM4 PHY IP
- 10-bit SAR ADC - XFAB XT018
- eFuse Controller IP
Related News
- Lorentz Solution Joins Intel Foundry Services (IFS) Accelerator EDA Alliance Program to Enable Peakview EM Platform and Accelerate IC and 3DIC Designs
- proteanTecs Joins Intel Foundry Services (IFS) Accelerator IP Alliance Program
- Agile Analog joins Intel Foundry Services Accelerator IP Alliance Program to drive forward semiconductor design innovation
- Rambus Joins the Intel Foundry Services (IFS) Accelerator IP Alliance to Enable State-of-the-Art SoCs
Latest News
- Former Altera CEO Sandra Rivera Assumes Role as VSORA’s Chair of the Board
- AccelerComm participates in Airbus UpNext SpaceRAN Demonstrator, Advancing Global 5G Connectivity in Space
- eMemory and PUFsecurity’s PUFPQC Achieves NIST FIPS 205 and SP 800-208 Certification, Reaching a Milestone in Comprehensive Post-Quantum Cryptography Protection
- SiFive to Power Next-Gen RISC-V AI Data Centers with NVIDIA NVLink™ Fusion
- SST and UMC Announce Immediate Availability of 28nm SuperFlash® Gen 4 Automotive Grade 1 Platform