IBM, Chartered claim broad EDA support at 90 nm
(05/24/2004 5:00 PM EDT)
EAST FISHKILL, N.Y. — IBM Corp. and Chartered Semiconductor Manufacturing Ltd. said Monday (May 24) that they have received support for their joint 90-nm manufacturing process from four leading EDA companies.
Nanometer-scale design libraries, EDA tools and standard foundry RTL-to-GDSII reference flows have been announced by Cadence Design Systems Inc., Magma Design Automation Inc., Mentor Graphics Corp. and Synopsys Inc.
"It is critical that we continue to develop and support a global technology platform that gives our customers access to the industry's most advanced 90-nm process and do it in a way that makes moving between our two foundries transparent.
As part of our collaboration with Chartered, customers get support from these key EDA suppliers simultaneously for both foundries, saving valuable time and providing enhanced sourcing options," said Tom Reeves, IBM's vice president, semiconductor products and solutions and the Systems & Technology Group.
"Our collaboration with IBM is focused on providing an unprecedented level of flexible access to leading-edge capacity from two of the world's leading manufacturers," said Kevin Meyer, vice president of worldwide marketing and services at Chartered.
Related Semiconductor IP
- SLVS Transceiver in TSMC 28nm
- 0.9V/2.5V I/O Library in TSMC 55nm
- 1.8V/3.3V Multi-Voltage GPIO in TSMC 28nm
- 1.8V/3.3V I/O Library with 5V ODIO & Analog in TSMC 16nm
- ESD Solutions for Multi-Gigabit SerDes in TSMC 28nm
Related News
- Chartered and Mentor Graphics Team to Offer Technology Design Kits for 65 and 90 Nanometer Common Platform Technology Processes
- ARM, Chartered, IBM and Samsung Collaborate to Enable Energy-Efficient 32nm and 28nm Systems-on-Chip
- ARM, Chartered, IBM, Samsung, and Synopsys Collaborate to Deliver Vertically Optimized Solution for 32/28nm Mobile SoC Designs
- Dolphin Integration first to achieve 0.84 pA per bit in SpRAM at the 90 nm uLL embedded flash process
Latest News
- Latest intoPIX JPEG XS Codec Powers FOR-A’s FA-1616 for Efficient IP Production at NAB 2025
- VeriSilicon Launches ISP9000: The Next-Generation AI-Embedded ISP for Intelligent Vision Applications
- GUC Announces Tape-Out of the World's First HBM4 IP on TSMC N3P
- lowRISC and SCI Semiconductor Release Sunburst Chip Repository for Secure Microcontroller Development
- BrainChip Partners with RTX’s Raytheon for AFRL Radar Contract