Xilinx Improves Transceiver Simulation Time 100x With Release of Industry's First IBIS-AMI FPGA Transceiver Models
100Gbps Simulations in Minutes Instead of Hours
SAN JOSE, Calif. -- Nov. 10, 2009 -- Xilinx, Inc. (Nasdaq: XLNX) today announced the availability of the industry's first IBIS-AMI models for FPGA transceivers. Xilinx is the first FPGA provider and among the first silicon vendors to release IBIS-AMI models for its transceiver technology that will enable designers to reduce simulation time from hours to minutes.
Xilinx and Signal Integrity Software, Inc. (SiSoft) will hold a free webinar on Thursday, Nov. 12 to outline the advantages of using IBIS-AMI models for transceiver simulation.
Next generation communications, networking, and consumer electronics products are replacing high-speed parallel interfaces with multi-gigabit serial links as the primary means of moving data within a system. Conventional signal integrity and timing analysis (e.g. HSPICE) won't work for these links, which require analyzing millions of bits worth of behavior to reliably determine how jitter, noise and crosstalk affect link operating margins.
The IBIS-AMI (I/O Buffer Information Specification - Algorithmic Modeling Interface) modeling specification enables standardized, interoperable simulation of SerDes PHYs at the high levels of simulation performance and accuracy needed to correctly predict the behavior of serial links. This webinar highlights how IBIS-AMI based simulation will enable you to increase design reliability while reducing engineering design time.
Using Xilinx's IBIS-AMI models and SiSoft's Quantum Channel Designer software, systems designers can experiment with different combinations of channel lengths, connectors, via designs and transmit / receive equalization to quickly determine which configurations provide adequate operating margin and which don't. Pre- and post-layout simulation with Quantum Channel Designer allows designers to validate designs and reduce time to market while increasing confidence in their design's reliability and manufacturability.
This free webinar will focus on the following topics:
- Xilinx IBIS-AMI simulation models for Virtex®-5, Virtex®-6 and Spartan®-6 FPGAs
- Predicting serial link operating margins using simulation
- Co-optimizing your channel design and SerDes configuration
- Assessing the impact of jitter, noise & crosstalk
- Xilinx IBIS-AMI Design Kits for SiSoft's Quantum Channel Designer
"Our experience helping customers implement the industry's first 100Gbps designs has taught us that HSPICE simulations of these wide datapaths can take hours to achieve a result," said Senior Director of the Xilinx SERDES Technology Group, David Demarinis. "As a result, we are pleased to announce the public availability of the first IBIS-AMI models in the FPGA industry to allow customers 100x faster simulation times."
Learn more:
- Sign up for the complimentary webinar on Thursday, November 12, 2009 at : http://www.sisoft.com/news_events_xilinx_webinar.asp
- Xilinx IBIS-AMI models can be downloaded here: http://www.xilinx.com/support/download/virtex5ibisami.htm
About Xilinx
Xilinx is the worldwide leader in complete programmable logic solutions. For more information, visit www.xilinx.com.
Related Semiconductor IP
- NFC wireless interface supporting ISO14443 A and B with EEPROM on SMIC 180nm
- DDR5 MRDIMM PHY and Controller
- RVA23, Multi-cluster, Hypervisor and Android
- HBM4E PHY and controller
- LZ4/Snappy Data Compressor
Related News
- LSI Logic Demonstrates Fully Functional 6.4 Gigabits Per Second HyperPHY(R) Transceiver Core
- Xignal Technologies sets world record for jitter performance in 10-Gigabit technology : New 10 Gb/s CMOS Transceiver Improves Data Transmission Performance in Local, Metro and Wide-Area Networks
- Nordic launches industry's highest integration low voltage supply, long-range 430-928MHz transceiver family with embedded MCU and ADC
- New Low-Pin, Hi-Speed USB transceiver interface endorsed by leading USB connectivity providers including ARC International, Conexant, Mentor Graphics, Philips, Standard Microsystems Corporation (SMSC), and TransDimension Inc.
Latest News
- CAST Releases First Dual LZ4 and Snappy Lossless Data Compression IP Core
- Arteris Wins “AI Engineering Innovation Award” at the 2025 AI Breakthrough Awards
- SEMI Forecasts 69% Growth in Advanced Chipmaking Capacity Through 2028 Due to AI
- eMemory’s NeoFuse OTP Qualifies on TSMC’s N3P Process, Enabling Secure Memory for Advanced AI and HPC Chips
- AIREV and Tenstorrent Unite to Launch Advanced Agentic AI Stack