HiSilicon, a Division of Huawei, Extends License of Tensilica's IP Cores, ConnX Baseband Engine, and HiFi Audio DSP for LTE Base Stations and Handsets
Schenzen, CHINA - February 3, 2011 - Tensilica, Inc. today announced that HiSilicon Technologies, a division of Huawei, has expanded its license (announced February 9, 2010) for Tensilica's dataplane processors (DPUs), ConnX Baseband Engine (BBE16), and HiFi Audio DSP (digital signal processing) semiconductor IP cores for LTE (Long-Term Evolution) basestations, handsets and other network infrastructure and customer premise equipment.
"Now that we've worked for over a year with Tensilica, we are quite impressed with the capabilities, ease of use, and efficiency in terms of power, performance, and area achieved with Tensilica DPUs," stated Teresa He, vice president of HiSilicon. "We have used Tensilica's Vectra and ConnX BBE16 and they are best-in-class for baseband signal processing and can be optimized to improve speed, power and performance. We have also selected Tensilica's HiFi Audio DSP core, which provides performance at the lowest power and comes complete with software support for the major audio and voice standards."
"We are very pleased that HiSilicon, the leader in LTE networks, has expanded its use of Tensilica DPUs through this multi-year agreement," stated Jack Guedj, Tensilica's president and CEO. "HiSilicon's broad adoption of Tensilica, in both mobile wireless and network infrastructure designs, is a testimonial to the benefits of our ability to achieve best-in-class speed, performance and power that can be rapidly optimized to precisely tailor to each SOC design without compromise."
About Tensilica
Tensilica, Inc. is the leader in customizable dataplane processor IP cores. Dataplane Processor Units (DPUs) combine the best capabilities of DSP and CPU while delivering 10 to100x the performance because they can be optimized using Tensilica's automated design tools to meet specific signal processing performance targets. Tensilica's DPUs power SOC designs at system OEMs and six out of the top 10 semiconductor companies for products including mobile phones, consumer electronics devices (including digital TV, Blu-ray Disc players, broadband set top boxes, digital still cameras and portable media players), computers, and storage, networking, wireless base station and communications equipment. For more information on Tensilica's patented, benchmark-proven DPUs visit www.tensilica.com.
Related Semiconductor IP
- Simulation VIP for Ethernet UEC
- Bluetooth® Low Energy 6.2 PHY IP with Channel Sounding
- Simulation VIP for UALink
- General use, integer-N 4GHz Hybrid Phase Locked Loop on TSMC 28HPC
- JPEG XL Encoder
Related News
- HiSilicon, a Division of Huawei, Licenses Tensilica's Xtensa Dataplane Processor and ConnX DSP IP Cores
- HiSilicon Extends Multi-License Deal with Vivante for Graphics IP
- InvenSense Provides High-Accuracy Turn-By-Turn Navigation User Experience To HiSilicon Mobile Platforms And Huawei Smartphones
- HiSilicon Divison of Huawei licenses UltraSoC's SoC monitoring and analytics solutions
Latest News
- Mixel MIPI IP Integrated into Automotive Radar Processors Supporting Safety-critical Applications
- GlobalFoundries and Navitas Semiconductor Partner to Accelerate U.S. GaN Technology and Manufacturing for AI Datacenters and Critical Power Applications
- VLSI EXPERT selects Innatera Spiking Neural Processors to build industry-led neuromorphic talent pool
- SkyWater Technology and Silicon Quantum Computing Team to Advance Hybrid Quantum-Classical Computing
- Dnotitia Revolutionizes AI Storage at SC25: New VDPU Accelerator Delivers Up to 9x Performance Boost