Gaisler Research AB and Gleichmann & Co. Electronics GmbH signs agreement covering the use, marketing and sales of the LEON processor
-- An agreement has been signed by Gaisler Research and Gleichmann Electronics. Gleichmann Electronics will under this agreement be able to offer customers the LEON processor and adjacent IP-cores and tools as a part of their product portfolio and design services.
- This agreement will further strengthen our presence on the German and European market. The strong marketing, sales and design capabilities of Gleichmann is a perfect complement to the high performance IP-products developed by Gaisler Research says Per Danielsson the CEO of Gaisler Research AB.
- The LEON processor is a perfect match with the System on a Chip (SoC) design service that we provide to our customers. The agreement will enable us to offer even more cost effective and performant SoC solutions says Dieter Scheurer the Manager of the ASIC design center at Gleihcmann.
About Gaisler Research AB
Gaisler Research AB is a provider of SoC solutions for exceptionally competitive markets such as Aerospace, Military and demanding Commercial applications. The Gaisler Research's products consist of user-customizable 32-bit SPARC V8 processor cores, peripheral IP-cores and associated software and development tools. Gaisler Research solutions help companies develop highly competitive customer and application-specific SoCs.
About Gleichmann ASIC Design Center
The Gleichmann ASIC Design Center offers support and solutions for ASIC development. The ASIC design centres have 10 engineers dedicated to support and design. The long experience, relation and access to FPGA and ASIC suppliers guarantees the ability of a complete design service. The Research Center in Hagenberg (Upper Austria) develops together with the University of Applied Science high end future solution for the embedded processor market and high sophisticated ASIC development tools like the Hpe Boards and the Hardware Accelerator and Co-simulator HAC.
Related Semiconductor IP
- Bluetooth Low Energy 6.0 Digital IP
- Ultra-low power high dynamic range image sensor
- Flash Memory LDPC Decoder IP Core
- SLM Signal Integrity Monitor
- Digital PUF IP
Related News
- Austrian Research Centers GmbH and Gaisler Research AB signs license agreement for LEON3 and the GRLIB IP library
- JFE Shoji Electronics Signs Sales Agent Agreement with Andes Technology
- Gaisler Research AB launches the LEON3 processor as a standard component using the space qualified and radiation tolerant Actel RTAX2000S FPGA
- EONIC BV and Gaisler Research AB signs license agreement for LEON3 multiprocessor
Latest News
- Cadence Design Systems Agrees to Plead Guilty and Pay Over $140 Million for Unlawfully Exporting Semiconductor Design Tools to a Restricted PRC Military University
- Ceva Retains Top Spot in Wireless Connectivity IP in Latest IPnest Report
- SkyWater Technology Expands Leadership in U.S. Semiconductor Manufacturing with Infineon IP License Agreement
- Cadence Reports Second Quarter 2025 Financial Results
- Rambus Reports Second Quarter 2025 Financial Results