FSA Reports Fabless Revenue Topped $23B in 1H 2006
September 26, 2006
Who: | FSA - the voice of the global fabless business model |
What: | FSA issued its CYQ2 2006/Mid-Year Global Fabless Fundings & Financials Report, outlining key statistics for industry growth in 1H 2006, including:
|
When: | The complimentary report is available to both FSA members and members of the media. The report is also available for purchase to the industry via the FSA Store . |
About FSA:
FSA is the voice of the global fabless business model. Incorporated in 1994, FSA positively impacts the growth and return on invested capital of this business model to enhance the environment for innovation. It provides a platform for meaningful global collaboration between fabless companies and their partners; identifies and articulates opportunities and challenges to enable solutions; and provides research, resources, publications and survey information. Members include fabless companies and their supply chain and service partners, representing more than 21 countries across the globe. www.fsa.org.
Related Semiconductor IP
- Multi-channel, multi-rate Ethernet aggregator - 10G to 400G AX (e.g., AI)
- Multi-channel, multi-rate Ethernet aggregator - 10G to 800G DX
- 200G/400G/800G Ethernet PCS/FEC
- 50G/100G MAC/PCS/FEC
- 25G/10G/SGMII/ 1000BASE-X PCS and MAC
Related News
- FSA Reports Fabless Revenue Topped $40B in 2005 Becoming Highest Annual Total in Fabless History
- FSA Announces 27 Percent Worldwide Fabless Revenue Growth in 2004
- FSA Finds Funding of Fabless Companies Rises 36% QoQ
- FSA Releases Analysis of Q2 2005 for the Fabless Sector
Latest News
- How CXL 3.1 and PCIe 6.2 are Redefining Compute Efficiency
- Secure-IC at Computex 2025: Enabling Trust in AI, Chiplets, and Quantum-Ready Systems
- Automotive Industry Charts New Course with RISC-V
- Xiphera Partners with Siemens Cre8Ventures to Strengthen Automotive Security and Support EU Chips Act Sovereignty Goals
- NY CREATES and Fraunhofer Institute Announce Joint Development Agreement to Advance Memory Devices at the 300mm Wafer Scale