FinFETs Flow at Samsung, TSMC
Apple, Qualcomm are key customers
Jessica Lipsky, EETimes
2/3/2016 10:00 AM EST
SAN DIEGO, Calif. – Production of next-generation FinFET chips is underway at Samsung and TSMC. Although Samsung announced mass production of its 14nm LPP process technology with a major customer win in Qualcomm, TSMC may have the last laugh with Apple using its process.
In January, Samsung announced its 14nm Low Power Plus (LPP) process with 14% more performance than its LPE process, 0.8V power profile, and a 10% smaller die size over 28nm. Qualcomm will build its Snapdragon 820 chips in 14nm LPP, and Globalfoundries has licensed the process for its fabs.
“This is a great endorsement by a tier one company,” said Samsung Semiconductor's Kelvin Low, senior director of foundry marketing. “Especially many years ago when we started foundry business, there was always a concern about Samsung competing with our customers.”
To read the full article, click here
Related Semiconductor IP
- Bluetooth Low Energy 6.0 Digital IP
- Ultra-low power high dynamic range image sensor
- Flash Memory LDPC Decoder IP Core
- SLM Signal Integrity Monitor
- Digital PUF IP
Related News
- Silicon Creations Taps Silvaco's Custom Design Flow for 10nm FinFET Designs
- Silicon Creations Relies on Silvaco's Custom Design Flow for New Advanced FinFET Designs
- Synopsys Full EDA Flow First to Achieve Samsung Foundry 4LPP Process Certification
- Synopsys 3DIC Compiler Qualified for Samsung Foundry's Multi-Die Integration Flow, Accelerating 2.5D and 3D Designs
Latest News
- Cadence Design Systems Agrees to Plead Guilty and Pay Over $140 Million for Unlawfully Exporting Semiconductor Design Tools to a Restricted PRC Military University
- Ceva Retains Top Spot in Wireless Connectivity IP in Latest IPnest Report
- SkyWater Technology Expands Leadership in U.S. Semiconductor Manufacturing with Infineon IP License Agreement
- Cadence Reports Second Quarter 2025 Financial Results
- Rambus Reports Second Quarter 2025 Financial Results