EXTOLL collaborates with ERIDAN as a Key Partner for Lowest Power High-Speed SerDes IP on GlobalFoundries’ 22FDX

Mannheim, Germany -- August 25, 2025 — EXTOLL, a leading provider of high-speed and ultra-low-power SerDes and Chiplet connectivity, has been selected by Eridan, an innovation and technology leader in digital 5G power efficient radios, as a key SerDes IP supplier for its next gen ASIC development portfolio. These new solutions will be manufactured by GlobalFoundries (GF), enabled via the GlobalShuttle multi-project wafer program, and utilize GF’s high-performance, low power 22FDX® process technology.

“We are delighted and esteemed to jointly work with Eridan and Chip Interfaces on creating solutions for breakthrough technology in 5G coverage and throughput. This collaboration accents EXTOLL´s strength in ultra-low power design, particularly on GlobalFoundries’ 22FDX platform, enabling future communication innovations,” says Dirk Wieberneit, CEO of EXTOLL.

EXTOLL´s IP is optimized to deliver highest speeds at smallest footprint and lowest power consumption, enabling a super energy-efficient solution for chiplet-based systems and providing a unique solution for the rising demand on multiple-lane connections. Through the partnership with Chip Interfaces, fully integrated and verified JESD204 multi-lane solutions are made available, supporting line speeds up to 32Gbps per lane and silicon proven for GF’s 22FDX and 12LP platforms.

“We are excited to partner with EXTOLL on their industry-leading SerDes technology on GF’s 22FDX platform,“ said Doug Kirkpatrick, Eridan Co-Founder and CTO. “EXTOLL is continuing to innovate on this process node, enabling a unique solution for best-in-class power and performance that our applications require. This makes them a perfect fit for Eridan´s ambitious lowest power products for 5G small cells, massive MIMO, and beyond.”

“Partnering with EXTOLL and Eridan to deliver an IP solution tailored for the project requirement underscores our commitment to providing technology that directly meets our customers’ evolving demands,” said Anne Voss Winther, CEO at Chip Interfaces. “Our JESD204C IP, supporting line rates up to 32.5Gbps per lane with 64b/66b encoding, has been successfully combined with EXTOLL’s ultra-low-power SerDes on GF’s 22FDX platform to create a fully verified, high-performance interface solution, that enabled the customers project success.”

GF’s 22FDX process technology offers superior RF/Mixed-Signal performance, power efficiency, SoC integration and radiation-hardened reliability for technologies in the communications infrastructure and SATCOM markets. 22FDX is the only fully depleted SOI solution that combines high-performance RF capabilities with high-speed, high-density digital logic and ultra-low power capabilities for applications requiring both power efficiency and high-speed connectivity.

“We are delighted to see our IP partner EXTOLL continuing to innovate on our 22FDX platform, now partnering with Eridan to enable digital 5G radios with high-speed, energy-efficient ASICs,” said Ziv Hammer, Senior Vice President of Design Platforms and Services at GF.  “Working closely with our partners and customers, GF continues to advance global connectivity with essential chips that support the growing demand for faster, more reliable networks with higher bandwidth and increased coverage.”

About EXTOLL

EXTOLL, a leading supplier of high-speed and ultra-low power SerDes and Chiplet connectivity, designs and develops semiconductor IP with the smallest footprints and highest PPA in the industry, serving the worldwide market of ASIC, SoC- and Chiplet-Makers in various segments. The portfolio provides customers with tailored solutions for their systems covering NoC (Network-on-Chip) and Die-to-Die interfaces.EXTOLL delivers innovative solutions to enable customers to successfully migrate into the Chiplet Age.

Find out more about our products and solutions – please visit us at www.extoll.com

About ERIDAN

Eridan develops fully digital 5G radios that combine ultra-clean signal quality with unparalleled energy efficiency. Its direct polar architecture delivers superior throughput and coverage in compact, low-power designs that scale from small cells to massive MIMO. By integrating advanced semiconductor and IP solutions into its custom chipset, Eridan brings cutting edge technology to wireless networks, enabling the next generation of connectivity. Learn more at www.eridan.io