FDSOI roadmap renames next node as 14-nm
Peter Clarke, EETimes
12/12/2012 7:02 AM EST
LONDON – Documents presented at the fully depleted silicon on insulator (FDSOI) workshop in San Francisco this week show that the FDSOI roadmap now omits a 20-nm and goes straight to 14-nm and then on to 10-nm.
A summary slide from Horacio Mendez, executive director of the SOI Consortium, showed the jump with the comment that 14-nm FDSOI would be offered at the same time as Intel's 14-nm FinFET and would show the same performance characteristics but realizable at much lower cost. A presentation by Joel Hartmann, executive vice president of front-end process for STMicroelectronics, at the same meeting, organized by the SOI Consortium, also shows the move from 28-nm FDSOI, a process that is has started to ship in the second-half of 2012, on to 14-nm FDSOI and then 10-nm FDSOI.
To read the full article, click here
Related Semiconductor IP
- Multi-channel Ultra Ethernet TSS Transform Engine
- Configurable CPU tailored precisely to your needs
- Ultra high-performance low-power ADC
- HiFi iQ DSP
- CXL 4 Verification IP
Related News
- GLOBALFOUNDRIES Extends FDX Roadmap with 12nm FD-SOI Technology
- Leading Semiconductor Players to Advance Next Generation FD-SOI Roadmap for Automotive, IoT and Mobile Applications
- 1G Ethernet PHY IP Core is now available in 14nm LPP for Blackbox License and in 28FDSOI as Whitebox License for maximum flexibility
- Artisan Components Furthers Library Roadmap with TSMC 0.13-Micron Agreement
Latest News
- SEALSQ and Lattice Collaborate to Deliver Unified TPM-FPGA Architecture for Post-Quantum Security
- SEMIFIVE Partners with Niobium to Develop FHE Accelerator, Driving U.S. Market Expansion
- TASKING Delivers Advanced Worst-Case Timing Coupling Analysis and Mitigation for Multicore Designs
- Efficient Computer Raises $60 Million to Advance Energy-Efficient General-Purpose Processors for AI
- QuickLogic Announces $13 Million Contract Award for its Strategic Radiation Hardened Program