Esperanto Pivots to HPC and Generative AI
By Sally Ward-Foxton, EETimes (August 22, 2023)
The company believes its chip is well-positioned to take advantage of the market for LLM inference today, Craig Cochran, a marketing executive at the Mountain View, Calif.-based company, told EE Times.
To read the full article, click here
Related Semiconductor IP
- HBM4 PHY IP
- eFuse Controller IP
- Secure Storage Solution for OTP IP
- Ultra-Low-Power LPDDR3/LPDDR2/DDR3L Combo Subsystem
- MIPI D-PHY and FPD-Link (LVDS) Combinational Transmitter for TSMC 22nm ULP
Related News
- Esperanto Technologies Announces RISC-V Industry Milestone Of Generative AI Models Running on ET-SoC-1; Access to be Made Available to the RISC-V Research Community
- Esperanto Technologies Introduces First Generative AI Appliance Based on RISC-V, Enabling Developers to Easily Create and Deploy Purpose-Built Vertical Applications
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- DEEPX Signs 2nm Process Agreement with Samsung Foundry to Develop World’s First On-Device Generative AI Chip ‘DX-M2’
Latest News
- LTSCT and Andes Technology Sign Strategic IP Licensing Master Agreement to accelerate RISC-V Based Advanced Semiconductor Solutions
- Global Semiconductor Sales Increase 29.8% Year-to-Year in November
- BAE Systems Licenses Time Sensitive Networking (TSN) Ethernet IP Cores from CAST
- HBM4 Mass Production Delayed to End of 1Q26 By Spec Upgrades and Nvidia Strategy Adjustments
- ASICLAND Secures USD 17.6 Million Storage Controller Mass Production Contract