DSP Concepts Enables Audio Weaver for the Cadence Tensilica HiFi 5 DSP
By Maurizio Di Paolo Emilio, EETimes (April 15, 2021)
DSP Concepts is announcing support for the Cadence Tensilica HiFi 5 DSP in its Audio Weaver platform, with a general release planned for the end of Q2 2021. The HiFi 5 is used for low power wireless products, headsets, wearables, and high-end automotive systems. DSP Concepts full suite of voice processing and playback IP will be made available allowing OEMs to create differentiated products leveraging Audio Weaver technology.
In an interview with EE Times, Paul Beckmann, CTO and founder at DSP Concepts, highlighted how the Tensilica HiFi 5 DSP includes hardware acceleration to enable voice-controlled user interfaces and artificial intelligence (AI)-based audio applications.
To read the full article, click here
Related Semiconductor IP
- 5G IoT DSP
- 5G RAN DSP
- 32-bit 8-stage superscalar processor that supports RISC-V specification, including GCNP (DSP)
- Compact High-Speed 32-bit CPU Core with DSP
- 16-bit fixed-point general purpose DSP
Related News
- Cadence Tensilica HiFi 5 DSPs Used in NXP's Next-Gen Audio DSP Family
- Cadence Introduces the Tensilica HiFi 5 DSP, the First DSP Optimized for AI Speech and Audio Processing
- DSP Concepts Enhances Audio Weaver to Support Cadence Tensilica HiFi DSPs
- Retune DSP Multi-Microphone Beamforming and Echo Cancellation Now Available for Cadence Tensilica HiFi Audio DSPs
Latest News
- Signal Edge Solutions Joins AMD Embedded Partner Program
- MediaTek Develops Chip Utilizing TSMC’s 2nm Process, Achieving Milestones in Performance and Power Efficiency
- RISC-V: Shaping the Future of Mobility with Open Standards and Strong Partnership
- ARTE Debuts New MPEG-H Dialog+ Feature
- Omni Design Technologies Secures over $35 Million in Series A Funding to Advance Its Leadership in Wideband Signal Processing™ for the AI Data Revolution