DSP Concepts Enables Audio Weaver for the Cadence Tensilica HiFi 5 DSP
By Maurizio Di Paolo Emilio, EETimes (April 15, 2021)
DSP Concepts is announcing support for the Cadence Tensilica HiFi 5 DSP in its Audio Weaver platform, with a general release planned for the end of Q2 2021. The HiFi 5 is used for low power wireless products, headsets, wearables, and high-end automotive systems. DSP Concepts full suite of voice processing and playback IP will be made available allowing OEMs to create differentiated products leveraging Audio Weaver technology.
In an interview with EE Times, Paul Beckmann, CTO and founder at DSP Concepts, highlighted how the Tensilica HiFi 5 DSP includes hardware acceleration to enable voice-controlled user interfaces and artificial intelligence (AI)-based audio applications.
To read the full article, click here
Related Semiconductor IP
- HiFi iQ DSP
- 5G IoT DSP
- 5G RAN DSP
- Tensilica ConnX 120 DSP
- 32-bit 8-stage superscalar processor that supports RISC-V specification, including GCNP (DSP)
Related News
- Cadence Tensilica HiFi 5 DSPs Used in NXP's Next-Gen Audio DSP Family
- Cadence Introduces the Tensilica HiFi 5 DSP, the First DSP Optimized for AI Speech and Audio Processing
- Cadence Unveils Tensilica HiFi iQ DSP Purpose-Built for Next-Generation Voice AI and Audio Applications
- DSP Concepts Enhances Audio Weaver to Support Cadence Tensilica HiFi DSPs
Latest News
- Alchip Reports ASIC-Leading 2nm Developments
- AI Demand Drives 4Q25 Global Top 10 Foundries Revenue Up 2.6% QoQ; Samsung Gains Share and Tower Moves Up in Rankings
- GlobalFoundries Announces Availability of AutoPro150 eMRAM Technology on Enhanced FDX Platform for Advanced Automotive Applications
- Axiomise Launches nocProve for NoC Verification
- CAST Debuts TSN-EP-10G IP for High-Performance, Time-Sensitive Networking Ethernet Designs