Transmeta Appoints Dan Hillman as Vice President of Engineering
SANTA CLARA, CA. - Dec 21, 2007 - Transmeta Corporation today announced that Dan Hillman has joined its executive team as vice president of engineering. Mr. Hillman will report to Les Crudele, president and CEO of Transmeta, and will be responsible for managing the company's engineering, research and development efforts.
"I am pleased to welcome Dan to our team as vice president of engineering," said Mr. Crudele. "Dan brings to Transmeta over 35 years of experience across a variety of sectors including IP licensing, chip design, and electronic design automation (EDA), all of which are applicable to Transmeta as we work to promote the adoption of our LongRun2 Technologies by a broader market."
Mr. Hillman's diverse background spans a range of technology companies and disciplines relevant to Transmeta's business. Before joining Transmeta, Mr. Hillman served as vice president of Engineering for MOSAID Technology, a licensor of semiconductor intellectual property. Mr. Hillman joined MOSAID as a result of MOSAID's acquisition of Virtual Silicon Technology, a privately held supplier of semiconductor intellectual property, where Mr. Hillman served as vice president of engineering through its acquisition by MOSAID in 2005. Before joining Virtual Silicon, Mr. Hillman served as vice president of engineering for inSilicon, a provider of communications semiconductor intellectual property, which was acquired by Synopsys. Previously, he was also the Corporate Application Group director for the Physical Synthesis Business Unit of Synopsys for eight years. Mr. Hillman also spent 11 years at Apple Computer as a hardware manager where he was directly involved in the design of the Apple IIGS and Macintosh computers, and also led a team that developed the IEEE 1394 (Firewire) Serial Bus. He began his career at RCA Corporation and Zilog Corporation.
Mr. Hillman holds a B.S. in Electrical Engineering from Purdue University.
About Transmeta Corporation
Transmeta Corporation develops and licenses innovative computing, microprocessor and semiconductor technologies and related intellectual property. Founded in 1995, we first became known for designing, developing and selling our highly efficient x86-compatible software-based microprocessors, which deliver a balance of low power consumption, high performance, low cost and small size suited for diverse computing platforms. We are presently focused on developing and licensing our advanced power management technologies for controlling leakage and increasing power efficiency in semiconductor and computing devices, and in licensing our computing and microprocessor technologies to other companies. To learn more about Transmeta, visit www.transmeta.com.
Related Semiconductor IP
- RISC-V CPU IP
- AES GCM IP Core
- High Speed Ethernet Quad 10G to 100G PCS
- High Speed Ethernet Gen-2 Quad 100G PCS IP
- High Speed Ethernet 4/2/1-Lane 100G PCS
Related News
- Virtual Silicon Names Dan Hillman VP of Business Operations and Infrastructure
- Actel Appoints Dan McCranie to Board of Directors
- Tower Semiconductor Appoints Udi Hillman to Acting Chief Executive Officer
- Tensilica Names Dan Weed as Vice President of Customer Engineering
Latest News
- HPC customer engages Sondrel for high end chip design
- PCI-SIG’s Al Yanes on PCIe 7.0, HPC, and the Future of Interconnects
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- Cadence Unveils Arm-Based System Chiplet
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers