ChipIdea's Analog Front-End for Power Line Communications Modem sucessfully integrated in INSONET transceiver chip
February 4, 2003 - Following the silicon verification of ChipIdea's Analog Front-End for Power Line Communications, the core was further enhanced and integrated with a powerfull OFDM BaseBand processor into a single chip. Test results show improved performance over the first silicon version.
Chipidea's Analog Front-End solution for Power Line Communications is a macro-block with I/Q receive and transmit port that includes signal conversion, filtering, frequency translation, and synthesis functions necessary to interface an OFDM baseband processor to the Power Line.
Associated INSONET technology has demonstrated up to 10Mbps over Power Lines, with a 4.268MHz OFDM signal bandwidth flexibly allocated between 10MHz to 30MHz.
Test results show the transmitter achieving up to 56dB SFDR and 47dB SINAD. The receiver performance exceeds 54dB SINAD.
Current consumption, for a 3.3V power supply, is around 200mA in full operation.
This CI7118ja block has been designed in 0.35um CMOS technology, and is retargetable towards any sub-micron CMOS technology with 2.5V/ 3V/ 5V supply, with double poly option.
Related Semiconductor IP
- USB 20Gbps Device Controller
- SM4 Cipher Engine
- Ultra-High-Speed Time-Interleaved 7-bit 64GSPS ADC on 3nm
- Fault Tolerant DDR2/DDR3/DDR4 Memory controller
- 25MHz to 4.0GHz Fractional-N RC PLL Synthesizer on TSMC 3nm N3P
Related News
- ABI Research Teardown: iPhone 4S has New RF Front End, Altered Qualcomm Modem, and a Throttled Apps Processor
- Omni Design's High Performance Analog Front Ends are Adopted in Socionext's Next Generation Communications SoCs
- ChipIdea has successfully qualified at 1st silicon several analog IPs embedded in a cable modem chip
- Tahoe RF Semiconductor Announces RF Receiver Front End and Integrated VCO IP Blocks Aimed At Multiple Wireless Standards
Latest News
- Analog Bits Adds New Power and Energy Management IP Blocks Proven on TSMC N2P and N3P Processes at TSMC 2025 OIP Ecosystem Forum
- EnSilica and Codasip announce strategic partnership
- Empower Semiconductor Secures Over $140M in Series D Financing
- Siemens unveils groundbreaking Tessent AnalogTest software for automated analog circuit test generation
- Euclyd Unveils CRAFTWERK: The World’s Most Power-Efficient Exascale Token Factory for Agentic AI