Tahoe RF Semiconductor Announces RF Receiver Front End and Integrated VCO IP Blocks Aimed At Multiple Wireless Standards

Tahoe RF today revealed their new “CoreTech(TM)” product line featuring the TRFS 151 Receiver Front End and TRFS 201 Integrated VCO IP Blocks, using the Jazz Semiconductor 0.35µm SiGe BiCMOS process.

AUBURN, CA--May 7, 2003 -- Targeted at multiple wireless communication standards, Tahoe RF Semiconductor, Inc., today opens their new RF IP “CoreTech(TM)” product line with the availability of the TRFS-151 CDMA RF Receiver Front End and the TRFS-201 Integrated VCO, both using the Jazz Semiconductor 0.35µm SiGe BiCMOS process (SiGe60).

The TRFS-151 IP Block is a low noise 900 MHz receiver front end incorporating a dual-gain low noise amplifier and a dual-gain down conversion mixer. With off-chip filtering, the TRFS 151 provides all the circuitry necessary to implement the front end of the IS-98B CDMA standard for cellular phones.

The TRFS-201 IP Block is a low phase noise CMOS fully integrated Voltage Controlled Oscillator (VCO). Operating at only 5mA from a 3V supply, this VCO can be easily modified to operate at many different center frequencies. The core circuitry has a very small footprint of less than 0.36 square mm and is also available with an integrated output buffer making it ideal for stand-alone use. Target applications are GSM, CDMA, WLAN, GPS, PCS/DCS and AMPS Wireless Communication Standards.

“These circuits have traditionally been among the toughest blocks to design in a radio system,” according to Chris Saint, Vice President of Engineering, Tahoe RF Semiconductor. “Our customers can now reduce the costly risk normally associated with these difficult areas of their design.”

Responding to today’s announcement, Irshad Rasheed, President of Tahoe RF Semiconductor Inc. added, “We are very excited about this new line. Our goal is to make the ‘CoreTech(TM)’ product line the most extensive set of ready to use RF IP Blocks in the world.”

Paul Kempf, Chief Technical Officer and Vice-President of Engineering at Jazz Semiconductor commented, “We are very excited to be working with Tahoe RF to provide our customers with these RF IP Platform products. We believe these blocks will enable our customers to significantly reduce their design cycle times, allowing them to get their products to market faster.”

ABOUT TAHOE RF SEMICONDUCTOR, INC.
Tahoe RF Semiconductor, Inc., provides world-class RFIC design services and high-performance, proven IP blocks to SoC manufacturers in the wireless communications market. Launched in 2002 from key engineers and managers from the IBM Wireless division who have worked together since 1996, this team has repeated first silicon spec-compliant success for a variety of customers. Located in the Sierras near Lake Tahoe in California, this team provides everything from front-end architecture, design and simulation all the way to back-end layout, DRC/LVS, post-layout simulation and fully packaged fabrication support and management. For additional information, visit us at www.TahoeRF.com.

ABOUT JAZZ SEMICONDUCTOR
Jazz Semiconductor manufactures semiconductor wafers that enable the development of high-performance, low-power radio-frequency (RF) wireless and broadband wireline communications products. The company’s rich heritage in analog and RF integrated circuits (IC) manufacturing has evolved into a leadership position in silicon germanium (SiGe) bipolar complementary metal oxide semiconductor (BiCMOS) and silicon BiCMOS technologies and design tools that are setting the standard for communications IC foundry services. The company’s wafers are manufactured using bipolar, BiCMOS, SiGe, analog, and mixed-signal CMOS process technologies. The Newport Beach ISO9001-certified facility includes 100,000 square feet of Class 1 clean-room space, and has the capacity to support 21,000 eight-inch wafer starts per month. Jazz Semiconductor is a privately held company headquartered in Newport Beach, CA. and has approximately 670 employees. To learn more, visit us at www.jazzsemi.com