Chip makers must shift from fabs to systems
Fabs "evaporated" as differentiator, says Infineon CEO
Rick Merritt, EE Times
(01/15/2008 9:42 PM EST)
Rick Merritt, EE Times
(01/15/2008 9:42 PM EST)
SAN FRANCISCO — Semiconductor companies need to shift their focus from building fabs to building systems, and they must engage with customers at deep technical levels if they are to survive the current wave of consolidation. That's the view of Wolfgang Ziebart, chief executive of Infineon Technologies.
"The major thing giving semiconductor makers a competitive advantage has evaporated," said Ziebart in an interview in the San Francisco offices of EE Times. "Today everyone has access to the same process technology at roughly the same time. This access used to be what differentiated the best from the worst semiconductor companies, but now it has evaporated," he said.
To read the full article, click here
Related Semiconductor IP
- NFC wireless interface supporting ISO14443 A and B with EEPROM on SMIC 180nm
- DDR5 MRDIMM PHY and Controller
- RVA23, Multi-cluster, Hypervisor and Android
- HBM4E PHY and controller
- LZ4/Snappy Data Compressor
Related News
- Arasan's 2nd Gen CAN IP achieves ISO26262 ASIL-C Certification
- Arasan proudly introduces the VESA VDC-M Encoder and Decoder IP
- Arasan proudly releases its Radiation Hardened NAND Flash IP
- Arasan's Total MIPI Camera IP solution with CSI and C-PHY achieve ISO26262 Certification
Latest News
- CAST Releases First Dual LZ4 and Snappy Lossless Data Compression IP Core
- Arteris Wins “AI Engineering Innovation Award” at the 2025 AI Breakthrough Awards
- SEMI Forecasts 69% Growth in Advanced Chipmaking Capacity Through 2028 Due to AI
- eMemory’s NeoFuse OTP Qualifies on TSMC’s N3P Process, Enabling Secure Memory for Advanced AI and HPC Chips
- AIREV and Tenstorrent Unite to Launch Advanced Agentic AI Stack