Updated: Sequans' WiMax chip drives Sprint Nextel's first 4G phone
Junko Yoshida, EETimes
(03/18/2010 10:55 AM EDT)
NEW YORK — It turns out that it's Sequans Communications, not Beceem, whose WiMax chip was designed into Sprint Nextel's first WiMax (4G) phone, scheduled to be unveiled next week during the CTIA wireless show.
By extension, it isn't MIPS Technologies, but CEVA, that received a big boost, since Sequans is using CEVA's DSP core in its WiMax/LTE baseband silicon.
Sequans' communication director Kimberly Tassin contacted EE Times to reveal that her company's baseband silicon is driving Sprint Nextel's first 4G phone.
To read the full article, click here
Related Semiconductor IP
- NFC wireless interface supporting ISO14443 A and B with EEPROM on SMIC 180nm
- DDR5 MRDIMM PHY and Controller
- RVA23, Multi-cluster, Hypervisor and Android
- CXL 3.0 Controller
- ECC7 Elliptic Curve Processor for Prime NIST Curves
Related News
- Sequans Communications Uses VeriSilicon's ZSP Core for WiMAX/LTE Products
- Sequans Licenses CEVA 5G Modem IP for Broadband IoT Platform
- CEVA SensPro Sensor Hub DSP Achieves Automotive Safety Compliant Certification for ASIL B (Random) and ASIL D (Systematic)
- Flex Logix and CEVA Announce First Working Silicon of a DSP with Embedded FPGA to Allow a Flexible/Changeable ISA
Latest News
- AIStorm and DB HiTek Debut SpectroMic™ KWS—an 18uA Always-on Keyword-Spotting Solution Enabling IoT AI Voice Interaction
- SignatureIP Unveils Industry-Leading CXL 3.2 Solution for High-Performance Computing
- Synopsys and Ansys Provide Update Regarding Expected Timing of Acquisition Close
- CAST Releases First Dual LZ4 and Snappy Lossless Data Compression IP Core
- Arteris Wins “AI Engineering Innovation Award” at the 2025 AI Breakthrough Awards