Austria's NewLogic receives certification for Bluetooth IP cores
Austria's NewLogic receives certification for Bluetooth IP cores
By Semiconductor Business News
January 3, 2001 (2:18 p.m. EST)
URL: http://www.eetimes.com/story/OEG20010103S0018
LUSTENAU, Austria -- Austria's NewLogic Technologies AG here announced it has completed the qualification phase of its intellectual-property (IP) cores for Bluetooth-enabled applications. This is believed to be the first Bluetooth-based IP cores to be certified in the market, enabling them to interoperate with other chips and systems in this arena, said Gianmaria Mazzucchelli, managing director of NewLogic. NewLogic offers three Bluetooth-based IP cores. The company's Boost family of IP products include a software protocol stack and a CMOS-based radio-frequency (RF) device. These IP elements, when combined with a suitable microcontroller core, permit theimplementation of a single chip Bluetooth solution using industry standard CMOS process technologies. "Our Boost IP products enable designers to integrate Bluetooth functionality into their ASIC and ASSP based products with a minimum of risk," said Hans-Peter Metzler, president and chief executive of NewLogic.
Related Semiconductor IP
- ULV Clock Generator - GLOBALFOUNDRIES 22FDX
- xSPI Multiple Bus Memory Controller
- MIPI CSI-2 IP
- PCIe Gen 7 Verification IP
- WIFI 2.4G/5G Low Power Wakeup Radio IP
Related News
- Gowin Semiconductor Adds Korea Certification For Their Bluetooth Low Energy Enabled MSoC FPGA Modules
- Bluetooth Dual Mode V5.3 RF Transceiver IP Cores in 22nm ULP is Available for Immediate Licensing for Smart Audio Chipsets
- VeriSilicon Obtained Bluetooth 5.3 Certification for Its Complete Bluetooth Low Energy Solution
- Bluetooth Dual Mode V5.3 RF Transceiver IP Cores in 40nm ULP is Available for Immediate Licensing
Latest News
- Premier ASIC and SoC Design Partner, Sondrel, Rebrands as Aion Silicon
- Intel Financial Risks, Layoffs, Foundry Ambitions
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
- China Takes the Lead in RF Front-End Patent Activity: RadRock and Others Surge Behind Murata
- Arteris Wins Two Gold and One Silver Stevie® Awards in the 2025 American Business Awards®