Austria's NewLogic receives certification for Bluetooth IP cores
Austria's NewLogic receives certification for Bluetooth IP cores
By Semiconductor Business News
January 3, 2001 (2:18 p.m. EST)
URL: http://www.eetimes.com/story/OEG20010103S0018
LUSTENAU, Austria -- Austria's NewLogic Technologies AG here announced it has completed the qualification phase of its intellectual-property (IP) cores for Bluetooth-enabled applications. This is believed to be the first Bluetooth-based IP cores to be certified in the market, enabling them to interoperate with other chips and systems in this arena, said Gianmaria Mazzucchelli, managing director of NewLogic. NewLogic offers three Bluetooth-based IP cores. The company's Boost family of IP products include a software protocol stack and a CMOS-based radio-frequency (RF) device. These IP elements, when combined with a suitable microcontroller core, permit theimplementation of a single chip Bluetooth solution using industry standard CMOS process technologies. "Our Boost IP products enable designers to integrate Bluetooth functionality into their ASIC and ASSP based products with a minimum of risk," said Hans-Peter Metzler, president and chief executive of NewLogic.
Related Semiconductor IP
- Multi-channel, multi-rate Ethernet aggregator - 10G to 400G AX (e.g., AI)
- Multi-channel, multi-rate Ethernet aggregator - 10G to 800G DX
- 200G/400G/800G Ethernet PCS/FEC
- 50G/100G MAC/PCS/FEC
- 25G/10G/SGMII/ 1000BASE-X PCS and MAC
Related News
- Gowin Semiconductor Adds Korea Certification For Their Bluetooth Low Energy Enabled MSoC FPGA Modules
- Bluetooth Dual Mode V5.3 RF Transceiver IP Cores in 22nm ULP is Available for Immediate Licensing for Smart Audio Chipsets
- VeriSilicon Obtained Bluetooth 5.3 Certification for Its Complete Bluetooth Low Energy Solution
- Bluetooth Dual Mode V5.3 RF Transceiver IP Cores in 40nm ULP is Available for Immediate Licensing
Latest News
- How CXL 3.1 and PCIe 6.2 are Redefining Compute Efficiency
- Secure-IC at Computex 2025: Enabling Trust in AI, Chiplets, and Quantum-Ready Systems
- Automotive Industry Charts New Course with RISC-V
- Xiphera Partners with Siemens Cre8Ventures to Strengthen Automotive Security and Support EU Chips Act Sovereignty Goals
- NY CREATES and Fraunhofer Institute Announce Joint Development Agreement to Advance Memory Devices at the 300mm Wafer Scale