Austria's NewLogic receives certification for Bluetooth IP cores
Austria's NewLogic receives certification for Bluetooth IP cores
By Semiconductor Business News
January 3, 2001 (2:18 p.m. EST)
URL: http://www.eetimes.com/story/OEG20010103S0018
LUSTENAU, Austria -- Austria's NewLogic Technologies AG here announced it has completed the qualification phase of its intellectual-property (IP) cores for Bluetooth-enabled applications. This is believed to be the first Bluetooth-based IP cores to be certified in the market, enabling them to interoperate with other chips and systems in this arena, said Gianmaria Mazzucchelli, managing director of NewLogic. NewLogic offers three Bluetooth-based IP cores. The company's Boost family of IP products include a software protocol stack and a CMOS-based radio-frequency (RF) device. These IP elements, when combined with a suitable microcontroller core, permit theimplementation of a single chip Bluetooth solution using industry standard CMOS process technologies. "Our Boost IP products enable designers to integrate Bluetooth functionality into their ASIC and ASSP based products with a minimum of risk," said Hans-Peter Metzler, president and chief executive of NewLogic.
Related Semiconductor IP
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
- MIPI CSI-2 CSE2 Security Module
Related News
- Gowin Semiconductor Adds Korea Certification For Their Bluetooth Low Energy Enabled MSoC FPGA Modules
- Bluetooth Dual Mode V5.3 RF Transceiver IP Cores in 22nm ULP is Available for Immediate Licensing for Smart Audio Chipsets
- VeriSilicon Obtained Bluetooth 5.3 Certification for Its Complete Bluetooth Low Energy Solution
- Bluetooth Dual Mode V5.3 RF Transceiver IP Cores in 40nm ULP is Available for Immediate Licensing
Latest News
- Faraday Reports First Quarter 2026 Results
- Cadence Reports First Quarter 2026 Financial Results
- Rambus Reports First Quarter 2026 Financial Results
- CAST Introduces MAC-SEC-MG IP Core for Secure 10G+ Ethernet SoC Designs
- Crypto Quantique and Attopsemi Unite PUF and I-fuse® OTP technology to Deliver Zero-Overhead Device Enrollment on FinFET Technology