Austria's NewLogic receives certification for Bluetooth IP cores
Austria's NewLogic receives certification for Bluetooth IP cores
By Semiconductor Business News
January 3, 2001 (2:18 p.m. EST)
URL: http://www.eetimes.com/story/OEG20010103S0018
LUSTENAU, Austria -- Austria's NewLogic Technologies AG here announced it has completed the qualification phase of its intellectual-property (IP) cores for Bluetooth-enabled applications. This is believed to be the first Bluetooth-based IP cores to be certified in the market, enabling them to interoperate with other chips and systems in this arena, said Gianmaria Mazzucchelli, managing director of NewLogic. NewLogic offers three Bluetooth-based IP cores. The company's Boost family of IP products include a software protocol stack and a CMOS-based radio-frequency (RF) device. These IP elements, when combined with a suitable microcontroller core, permit theimplementation of a single chip Bluetooth solution using industry standard CMOS process technologies. "Our Boost IP products enable designers to integrate Bluetooth functionality into their ASIC and ASSP based products with a minimum of risk," said Hans-Peter Metzler, president and chief executive of NewLogic.
Related Semiconductor IP
- Configurable CPU tailored precisely to your needs
- Ultra high-performance low-power ADC
- HiFi iQ DSP
- CXL 4 Verification IP
- JESD204E Controller IP
Related News
- Gowin Semiconductor Adds Korea Certification For Their Bluetooth Low Energy Enabled MSoC FPGA Modules
- Bluetooth Dual Mode V5.3 RF Transceiver IP Cores in 22nm ULP is Available for Immediate Licensing for Smart Audio Chipsets
- VeriSilicon Obtained Bluetooth 5.3 Certification for Its Complete Bluetooth Low Energy Solution
- Bluetooth Dual Mode V5.3 RF Transceiver IP Cores in 40nm ULP is Available for Immediate Licensing
Latest News
- RaiderChip showcases the evolution of its local Generative AI processor at ISE 2026
- ChipAgents Raises $74M to Scale an Agentic AI Platform to Accelerate Chip Design
- Avery Dennison announces first-to-market integration of Pragmatic Semiconductor’s chip on a mass scale
- Ceva, Inc. Announces Fourth Quarter and Full Year 2025 Financial Results
- Ceva Highlights Breakthrough Year for AI Licensing and Physical AI Adoption in 2025