ARM Powered TTPCom Modem Delivers Market-Leading Size and Performance Advantages

CBEmacro modem architecture enables semiconductor vendors to compete effectively in the high-growth tri-mode EDGE/WCDMA/HSDPA market

CAMBRIDGE, UK – Jan. 18, 2006 – TTPCom Limited (TTPCom) and ARM [(LSE:ARM); (Nasdaq:ARMHY)], today announced the results of comparative analysis which reveal that wireless applications processors that integrate the TTPCom CBEmacro 3G modem occupy less silicon area than current market-leading solutions, and benefit from the significantly greater efficiency and performance of the ARM1156T2-S™ processor subsystem to produce industry-leading Power, Performance and Area (PPA). As a result, the CBEmacro modem architecture will reduce silicon cost and improve battery life of dual mode WCDMA/EDGE and tri-mode HSDPA/EDGE baseband modems thereby giving silicon partners a competitive advantage.

As OEMs and ODMs seek to deliver cost-effective, high-end functionality for mid-tier and entry level dual and tri-mode mode handsets in 2007, the semiconductor industry is looking for ways to deliver additional modem functionality at a lower price. The CBEmacro modem design combines TTPCom’s intelligent architecture with the ARM1156T2-S processor and AMBA® Fabric technology to enable licensees to deliver the industry’s most compact and performance optimised dual-mode EDGE/WCDMA or tri-mode EDGE/HSDPA (Cat 6, 8 and 10) baseband silicon. System integration of a modem with a multimedia applications processor is eased by the use of the latest AMBA 3 AXI™ high-performance system components and the ability to share major subsystems such as embedded trace functionality and further reduce overall silicon area. This will enable semiconductor companies to offer a modem with market-leading PPA and increase their addressable market by an order of magnitude.

“Footprint, power, and cost are key to gaining handset market share, where the baseband and applications processor duties have become paramount in today’s handset designs,” stated Peter DiPaolo, Communications Technology manager at Semiconductor Insights (SI). “SI has performed more than 40 technical analyses on leading-edge baseband and applications processor chips within the past year, including coverage of all of the major vendors. Bringing together our analytical expertise and TTPCom’s technical excellence, TTPCom was able to demonstrate that the CBEmacro 3G is a world class EDGE/ WCDMA modem design in both technical specification and die area.”

“When designing the CBEmacro 3G platform, we set out not only to provide our customers with competitive advantage through dual mode WEDGE and HSDPA functionality, but to enable them to compete directly with the world’s leading players on die size, performance and power consumption,” said Julian Hildersley, managing director of TTPCom’s Silicon Business Unit. “Bill of Material (BoM) costs are crucial in today’s competitive handset market where as little as 50 cents can make or break a deal. Consequently every millimeter of die area saved improves the economics of the deal.” 

A comparative analysis, in which the CBEmacro modem (EDGE/ WCDMA) replaced the modem functionality in a state-of-the-art wireless applications processor demonstrated TTPCom’s design leadership. In a like for like comparison on a 90nm process, the CBEmacro 3G design provides for both higher technical specification and smaller die size than the current market leader. This size advantage translates into cost benefits and higher yields while enabling TTPCom’s customers to deliver an integrated baseband/applications processor loaded with key mass market peripherals.

“TTPCom’s CBEmacro modem combines their expertise in cellular modem with the latest ARM® Thumb®-2 technology-enabled processor, AMBA 3 AXI interconnect, PrimeCell® memory controllers and peripherals, CoreSight™ debug system and RealView® tools which has resulted in an innovative solution for semiconductor manufacturers,” said Rob Coombs, global director of Mobile Solutions, ARM. “Semiconductor Partners with advanced applications processors can now easily integrate a licensable cellular modem with market-leading PPA for the global cellular market. The CBEmacro modem’s extensive use of the latest ARM system components has contributed to the cost effectiveness of this system solution.”

To find out more or to see a demonstration of the TTPCom CBEmacro – visit TTPCom and ARM at the 3GSM in Barcelona.

• TTPCom: Hall 1 Stand C67
  
• ARM: C29 HS8.01

Performance advantages

In recent benchmarking activity, TTPCom modem software code in association with the ARM1156T2-S processor, compiled for ARM Thumb-2 technology, showed an efficiency gain of up to1.6x compared to the performance of previous generation cores running code compiled for Thumb technology. Consequently the processor and subsystem can be run at much lower frequencies, enabling implementation in ARM Artisan® MetroTM low-power libraries, and still achieve the desired modem functionality – a key issue for extended battery life.

About TTPCom

With 10 offices and development centres around the world, TTPCom Ltd. is the principal operating subsidiary of TTP Communications plc (LSE: TTC). The company develops intellectual property used in the design and manufacture of wireless communication terminals. TTPCom licenses its technology to leading semiconductor and terminal manufacturers worldwide, including Analog Devices, Intel, LG, NEC, Renesas, Sharp and Siemens.

TTPCom has established a world leading position with its GPRS, EDGE and 3G protocol software; offers rapid customisation of handsets through its AJAR applications framework; and develops both radio and baseband cellular engines through its macro products. More than 40 million devices using TTPCom technology were shipped during 2004. More information can be found on TTPCom's website at: http://www.ttpcom.com.

About ARM

ARM designs the technology that lies at the heart of advanced digital products, from wireless, networking and consumer entertainment solutions to imaging, automotive, security and storage devices. ARM’s comprehensive product offering includes 16/32-bit RISC microprocessors, data engines, 3D processors, digital libraries, embedded memories, peripherals, software and development tools, as well as analog functions and high-speed connectivity products. Combined with the company’s broad Partner community, they provide a total system solution that offers a fast, reliable path to market for leading electronics companies. More information on ARM is available at http://www.arm.com.