Arm IPO Faces Serious Difficulties, Observers Say
By Alan Patterson, EETimes (August 24, 2023)
SoftBank’s initial public offering (IPO) for Arm on the Nasdaq stock exchange, planned for as early as next month, faces major challenges because the British chip designer is overvalued and growth prospects are dim, analysts and a person close to the company told EE Times.
Japanese tech conglomerate SoftBank aimed for the IPO after an attempt to sell Arm for $40 billion to Nvidia last year failed because U.S. and European regulators cited antitrust concerns. SoftBank aims to sell a 10% stake in Arm in the IPO, for as much as $70 billion, according to Reuters. That would make it one of the world’s largest IPOs this year while allowing SoftBank to keep a controlling stake in Arm.
To read the full article, click here
Related Semiconductor IP
- 1.8V/3.3V I/O library with ODIO and 5V HPD in TSMC 16nm
- 1.8V/3.3V I/O Library with ODIO and 5V HPD in TSMC 12nm
- 1.8V to 5V GPIO, 1.8V to 5V Analog in TSMC 180nm BCD
- 1.8V/3.3V GPIO Library with HDMI, Aanlog & LVDS Cells in TSMC 22nm
- Specialed 20V Analog I/O in TSMC 55nm
Related News
- Arm IPO Likely to Lag Early Expectations, Observers Say
- SMIC Well on Its Way to 5-nm Breakthrough, Observers Say
- ARM signs Meta as first chip product customer, says report
- LogicVision reports 13% sequential growth in Q4 revenues after IPO
Latest News
- Will RISC-V reduce auto MCU’s future risk?
- Frontgrade Gaisler Launches New GRAIN Line and Wins SNSA Contract to Commercialize First Energy-Efficient Neuromorphic AI for Space Applications
- Continuous-Variable Quantum Key Distribution (CV-QKD) system demonstration
- Latest intoPIX JPEG XS Codec Powers FOR-A’s FA-1616 for Efficient IP Production at NAB 2025
- VeriSilicon Launches ISP9000: The Next-Generation AI-Embedded ISP for Intelligent Vision Applications