Apple completes its ARM lineup with 5nm, 134billion transistor M2 Ultra
By Nick Flaherty, eeNews Europe (June 5, 2023)
Apple has completed its range of ARM-based chips with the M2 Ultra, its largest to date with 134bn transistors.
As previously suggested, the M2 Ultra uses Apple’s UltraFusion interconnect and silicon interposer to combine two of the M2 Max die with a unified memory architecture. This has 10,000 signals, providing over 2.5TB/s of low-latency interprocessor bandwidth to support up to 192GB of memory capacity, 50 percent more than M1 Ultra, with 800GB/s of memory bandwidth, twice that of M2 Max.
To read the full article, click here
Related Semiconductor IP
- NFC wireless interface supporting ISO14443 A and B with EEPROM on SMIC 180nm
- DDR5 MRDIMM PHY and Controller
- RVA23, Multi-cluster, Hypervisor and Android
- HBM4E PHY and controller
- LZ4/Snappy Data Compressor
Related News
- Ultra Accelerator Link Consortium (UALink) Welcomes Alibaba, Apple and Synopsys to Board of Directors
- NEC Licenses ARM946E-S Microprocessor Core to Expand Advanced System LSI Line-up
- Altera Reveals Plans for 2004 Product Lineup
- Transmeta Announces That NEC Electronics' M2 Mobile Phone Chip Incorporates LongRun2 Technologies
Latest News
- CAST Releases First Dual LZ4 and Snappy Lossless Data Compression IP Core
- Arteris Wins “AI Engineering Innovation Award” at the 2025 AI Breakthrough Awards
- SEMI Forecasts 69% Growth in Advanced Chipmaking Capacity Through 2028 Due to AI
- eMemory’s NeoFuse OTP Qualifies on TSMC’s N3P Process, Enabling Secure Memory for Advanced AI and HPC Chips
- AIREV and Tenstorrent Unite to Launch Advanced Agentic AI Stack