Amkor to increase IC assembly and test capacity by 25%
Amkor to increase IC assembly and test capacity by 25%
By Jack Robertson, EBN
May 23, 2000 (11:33 a.m. EST)
URL: http://www.eetimes.com/story/OEG20000523S0008
Amkor Technology Inc., Chandler, Ariz., Tuesday said it will add nearly 25% more total capacity for its global chip assembly and testing operations by expanding plants in Korea and the Philippines. President John Boruch said a total of 800,000 additional sq. ft. of factory space will be added by mid-2001. A new 512,000-sq.-ft. building will be built near Manila to supplement three existing assembly plants there. An additional 200,000 sq. ft. of space will be added for assembly in the Philippines, taking over an area previously occupied by test, which has been moved to a new facility. Two expansions in Korea will increase assembly and design facilities there. Amkor earlier this year bought three Anam Semiconductor Inc. plants in South Korea for $950 million, as part of a larger series of investment by Amkor in the financially troubled company. Amkor originally was founded as Anam's marketing arm, but following Korea's economic meltdown in 1998 has continued to acquire manufacturing assets and took a 42% equity stake in the company to help Anam structure a settlement agreement with creditors.
Related Semiconductor IP
- RVA23, Multi-cluster, Hypervisor and Android
- 64 bit RISC-V Multicore Processor with 2048-bit VLEN and AMM
- NPU IP Core for Mobile
- V-by-One® HS plus Tx/Rx IP
- MSP7-32 MACsec IP core for FPGA or ASIC
Related News
- Amkor Technology and GlobalFoundries to Provide At-scale Semiconductor Test and Assembly Services in Europe
- GLOBALFOUNDRIES and Amkor to Collaborate on Advanced Assembly and Test Solutions
- GLOBALFOUNDRIES and GlobalWafers Sign MOU to Increase Capacity, Supply of 300mm SOI Wafers
- 2022 Semiconductor Sales to Grow 11% After Surging 25% in 2021
Latest News
- IAR platform boosts embedded development with upgraded toolchains for Arm and RISC-V
- Robust AI Demand Drives 6% QoQ Growth in Revenue for Top 10 Global IC Design Companies in 1Q25
- PCI-SIG® Releases PCIe® 7.0 Specification to Support the Bandwidth Demands of Artificial Intelligence at 128.0 GT/s Transfer Rates
- PCI-SIG® Announces PCIe® Optical Interconnect Solution
- Cadence Advances Design and Engineering for Europe’s Manufacturers on NVIDIA Industrial AI Cloud