mimoOn integrates LTE PHY software on Texas Instruments' new system-on-chips for small cell base stations
Highly optimized, pre-integrated solution offers customers increased scalability and reduced development time
Duisburg, GERMANY, August 1, 2011 – mimoOn, a pioneer in LTE software licensing for Software Defined Radio (SDR) platforms, today announced its collaboration with Texas Instruments Incorporated (TI) for 3GPP compliant LTE PHY software. TI will offer complete PHY software for LTE Release 8 and 9 for its’ KeyStone multicore architecture, with a specific focus on its newest TMS320TCI6612 and TMS320TCI6614 System-on-Chips (SoCs). These SoCs are especially designed for small cell base stations in the enterprise, pico and metro markets.
According to Thomas Kaiser, CEO of mimoOn, “We expect the LTE small cell market to grow substantially in the coming years. With a first design-in already confirmed, together we are already enabling OEMs to take delivery of a pre-integrated, fully optimized and production ready small cell solution.”
“Our new KeyStone-based small cell SoCs work very well with mimoOn’s LTE PHY software,” said Kathy Brown, General Manager, Wireless Base Station Infrastructure, TI. “mimoOn is an excellent partner for us to collaborate with to extend our market leading LTE performance into the small cell arena.”
Related Semiconductor IP
- USB 20Gbps Device Controller
- SM4 Cipher Engine
- Ultra-High-Speed Time-Interleaved 7-bit 64GSPS ADC on 3nm
- Fault Tolerant DDR2/DDR3/DDR4 Memory controller
- 25MHz to 4.0GHz Fractional-N RC PLL Synthesizer on TSMC 3nm N3P
Related News
- PCS Releases New 3GPP LTE Release 14-Compliant NB-IoT Transceiver IP Supporting High-Band and Low-Band Operation
- Palm to base next-generation wireless units on TI platform
- TI wraps DSP/RISC combo with RTOS support
- TI offers video extensions, software for rapid DSP development
Latest News
- Analog Bits Adds New Power and Energy Management IP Blocks Proven on TSMC N2P and N3P Processes at TSMC 2025 OIP Ecosystem Forum
- EnSilica and Codasip announce strategic partnership
- Empower Semiconductor Secures Over $140M in Series D Financing
- Siemens unveils groundbreaking Tessent AnalogTest software for automated analog circuit test generation
- Euclyd Unveils CRAFTWERK: The World’s Most Power-Efficient Exascale Token Factory for Agentic AI