3DSP Licenses its SP-5 core to Sony for next-generation advanced semiconductors
IRVINE, Calif., July 8, 2002 — 3DSP Corporation, the leader in configurable digital signal processor (DSP) architectures, today announced that Sony Corporation has licensed its SP-5™ DSP core and DSP-Shuttle™ Intelligent Bus Controller for its next-generation semiconductor products. The Sony Corporation Semiconductor Network Company has agreed to a division-wide, multiple-use license of the core and controller that will be designed initially into semiconductor devices for audio applications.
“We are thrilled to enter into a relationship with Sony, who continues to be a great innovator, and we look forward to facilitating their next-generation products,” said Kan Lu, CTO at 3DSP. “After going through a rigorous evaluation of our technology, this agreement represents a major endorsement of the proven usability of our DSP architectures while further validating our support infrastructure.”
“In this highly competitive marketplace where performance, power and price are significant factors in gaining a new customer, we are very pleased with the recognition from Sony,” claimed Didier Boivin, president and CEO of 3DSP. “This appears to be a very smart relationship,” said Will Strauss, president of research firm Forward Concepts. “In light of the slow turn-around of the telecommunications industry, addressing the healthy consumer electronics market with an innovative audio product makes good sense. This new relationship also confirms the continued viability of the IP business model for DSP cores.”
About 3DSP
3DSP offers the industry’s only fully configurable digital signal processing architecture with a comprehensive object-oriented design environment and application-based intellectual property. 3DSP’s technology empowers system designers to create custom SoC solutions in silicon that achieve significant competitive advantages in terms of performance, integration, power consumption, cost and time-to-market for tomorrow’s multimedia, wireless and Voice over Packet applications. For more information on the company and its products, visit www.3dsp.com or contact 3DSP headquarters at 16271 Laguna Canyon Rd., Irvine, CA 92618, phone: (949) 435-0600 fax: (949) 435-0700.
SP-5, DSP-Shuttle, 3DSP Corporation and 3DSP are trademarks of 3DSP Corporation.
Related Semiconductor IP
- Xtal Oscillator on TSMC CLN7FF
- Wide Range Programmable Integer PLL on UMC L65LL
- Wide Range Programmable Integer PLL on UMC L130EHS
- Wide Range Programmable Integer PLL on TSMC CLN90G-GT-LP
- Wide Range Programmable Integer PLL on TSMC CLN80GC
Related News
- e2v strengthens semiconductors business with acquisition of Signal Processing Devices
- CEVA's Bluetooth 5 Low Energy IP Powers ON Semiconductor's Ultra-Low-Power Radio SoC for IoT and Connected Health and Wellness Devices
- InPlay Technologies Licenses and Deploys CEVA's Bluetooth 5 Low Energy IP for Breakthrough SoC Targeting Wearable, Healthcare and Wireless IoT Markets
- Bestechnic Licenses CEVA Bluetooth 5 Dual Mode IP for its Audio Platforms
Latest News
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- The world’s first open source security chip hits production with Google
- ZeroPoint Technologies Unveils Groundbreaking Compression Solution to Increase Foundational Model Addressable Memory by 50%
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- AheadComputing Raises $21.5M Seed Round and Introduces Breakthrough Microprocessor Architecture Designed for Next Era of General-Purpose Computing