e2v strengthens semiconductors business with acquisition of Signal Processing Devices
February 3, 2016 -- e2v has strengthened its investment in high performance electronic solutions with the acquisitioni of Swedish signal processing design and development company, Signal Processing (SP) Devices.
SP Devices offers expertise in embedded error correction solutions for signal processing sub-systems and provides digitizers for demanding applications such as communications, radar and signal intelligence.
With this added expertise, e2v will offer solutions in error correction services for increased performance in time-interleaved Analog-to-Digital Converters (ADCs), linearized components, system and quadrature demodulators, and develop plans to release ADCs with enhanced performance specifications.
Richard Gibbs, President of e2v Semiconductors, said, “SP Devices presents excellent synergy with our existing data converter business; we continue to build on our signal processing chain solutions and these will now include digitizer boards, modules and even more service offerings.”
Tomas Wolf, CEO of SP Devices, commented, “We are excited to be a part of a company that values our heritage and continuously pushes the limits of what is possible in data acquisition solutions. In addition, for all our OEM customers this will provide additional organizational strength and capacity required for continued growth.”
Visit www.e2v.com/Semis for more information
Related Semiconductor IP
- RISC-V CPU IP
- AES GCM IP Core
- High Speed Ethernet Quad 10G to 100G PCS
- High Speed Ethernet Gen-2 Quad 100G PCS IP
- High Speed Ethernet 4/2/1-Lane 100G PCS
Related News
- e2v and SP Devices working together to deliver the ultimate in high-performance ADC solutions
- PUFsecurity's PUFiot Helps IoT Devices Meet FIDO Device Onboard Specification
- EnSilica evaluation platform for EN62020 sensor interface ASIC speeds up development of wearable fitness and healthcare sensor devices
- New MIPI SDCA Specification Simplifies Audio Software Architecture and Driver Requirements, Optimizing Integration of Audio Devices into Open Host Platforms
Latest News
- HPC customer engages Sondrel for high end chip design
- PCI-SIG’s Al Yanes on PCIe 7.0, HPC, and the Future of Interconnects
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- Cadence Unveils Arm-Based System Chiplet
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers