MagnaChip to Offer Cost Competitive 0.18um Embedded EEPROM Technology
SEOUL, South Korea -- May 4, 2010 -- MagnaChip Semiconductor Ltd., an Asia-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer applications, today announced that it now offers 0.18um embedded EEPROM technology to meet the specialized application needs of foundry customers.
MagnaChip has combined both cost competitiveness and device performance by introducing a 0.18um EEPROM cell size of (0.99um2). This is achieved by adopting the SSTC cell structure (side-wall selective transistor cell) rather than the conventional 2 transistor or split gate type cell structure. The EEPROM cell offered by MagnaChip is completely compatible with generic, low power, and ultra low power processes at various voltage levels including 1.8V, 1.8V+3.3V and 1.8V+5.0V. This design flexibility allows customers to meet many unique application requirements.
MagnaChip's EEPROM process also achieves advanced reliability characteristics with more than 30 years of data retention capability after 300 thousand pre-cycles combined with an endurance of over 300 thousand cycles. A group of EEPROM Macro IP ranging from 1Kbytes to 128Kbytes is currently available and supported by WingCore, a third party partner of MagnaChip. These macros provide fast access (30nsec) and write times (5msec) within a wide temperature range (-40C to +125C) meeting the most stringent customer applications.
TJ Lee, Senior Vice President of MagnaChip's Semiconductor Manufacturing Services Engineering, said, "We are very pleased to announce the offering of our 0.18um EEPROM solution to meet the increasing demand for low power solutions for mobile phone, automotive, medical, and consumer applications. MagnaChip has been making substantial progress in providing industry leading EEPROM process technologies and it is our continued goal to provide innovative and cost-effective manufacturing solutions for our customers."
MagnaChip's 0.18um EEPROM process, designed for low power applications requiring fast access time, allows customers to design a wide range of product solutions in a variety of end markets and is available now.
Related Semiconductor IP
- Multi-channel, multi-rate Ethernet aggregator - 10G to 400G AX (e.g., AI)
- Multi-channel, multi-rate Ethernet aggregator - 10G to 800G DX
- 200G/400G/800G Ethernet PCS/FEC
- 50G/100G MAC/PCS/FEC
- 25G/10G/SGMII/ 1000BASE-X PCS and MAC
Related News
- SMIC Announces Availability of 0.18um EEPROM Process Technology and EEPROM IP Design Platform
- MagnaChip Engages with eMemory in Joint Development of Leading Edge 0.18um EEPROM IP
- MagnaChip and eMemory to offer 0.18um EEPROM IP
- Kaben Research Developing a Delta-Sigma Modulator in TSMC 0.18um CMOS
Latest News
- How CXL 3.1 and PCIe 6.2 are Redefining Compute Efficiency
- Secure-IC at Computex 2025: Enabling Trust in AI, Chiplets, and Quantum-Ready Systems
- Automotive Industry Charts New Course with RISC-V
- Xiphera Partners with Siemens Cre8Ventures to Strengthen Automotive Security and Support EU Chips Act Sovereignty Goals
- NY CREATES and Fraunhofer Institute Announce Joint Development Agreement to Advance Memory Devices at the 300mm Wafer Scale