D2D IP
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23
IP
from 14 vendors
(1
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10)
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UCIe D2D Adapter
- The D2D Adapter for UCIe is a scalable adapter layer between one or more protocol components and the UCIe PHY, which ensures efficient data transfer across the UCIe Link by seamlessly coordinating with the Protocol Layer and Physical Layer.
- By minimizing logic on the main data path, it delivers a low-latency, optimized pathway for protocol Flits.
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D2D UCIe 1.1
- Compatible with UCIe v1.1 specification
- Features single-ended, source-synchronous, and DDR I/O signaling
- Supports 32-bit (16-bits TX + 16-bit RX) data bus per module for standard packages
- Offers a high clock frequency up to 16GHz
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D2D UCIe 1.0
- Compatible with UCIe v1.0 specification
- Single-ended, source synchronous and DDR IO Signaling
- Supports 32 bits(16bits TX + 16bits RX) data bus per module for standard package
- High clock frequency, up to 8GHz
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UCIe PHY & D2D Adapter
- 32Gbps UCIe-Advanced (UCIe-A) & Standard (UCIe-S)
- UCIe v1.1 specification
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40G UltraLink D2D PHY
- Innovative mixed-signal architecture to achieve high bandwidth, ultra low latency and low power
- Flexible data rate from 20Gbps to 40Gbps
- Built-in self-test features to ensure “known good die”
- Interoperable between different technology nodes and foundries
- Easy routing and straightforward integration
- Achieves better than 10-15 bit error rate (BER) without requiring forward error correction (FEC)
- Integrated scrambling and lane de-skew functionality
- Supports -40ºC to 125ºC industrial temperature range
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D2D Controller addon for D2D SR112G PHY with CXS interface
- Low Latency controller for die-to-die connectivity
- Supports PAM-4 and NRZ PHY signaling mode in all data rates
- Reduces BER with optional FEC configurations
- Supports Arm® AMBA® CXS interface
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2Gbps Low Power D2D Interface
- Core Device: 0.8V
- I/O Device: 1.8V Standard
- Core: Uses SVT only
- BEOL: M8 and below
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Low Power D2D Interface in TSMC 16nm FFC/FFC+
- This library is a production-quality, silicon-proven custom Die-to-Die high speed interface available in TSMC’s 16nm process.
- The I/O cell is bidirectional, has two modes of operation: standard full rail to rail swing, or a custom low noise pseudo-differential interface.
- The RX cells have a weak pull-down feature.
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Die-to-Die (D2D) Interconnect
- Adaptable to any communication protocols including extending SkyeChip’s Non-Coherent and Coherent NOC interconnects across multiple dies
- Architected to significantly reduce wiring overhead across multiple dies
- Supports transfer rates of up to 6.4GT/s
- Supports major 2.5D and 3D inter-die packaging technologies
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The UCIe CONTROLLER IP
- The UCIe IP solution includes D2D Adapter layer which supports streaming/PCIe/CXL/Raw flitformats, supports both standard and advanced mainband links and sideband links