connectivity IP

Filter
Filter

Login required.

Sign in

Login required.

Sign in

Login required.

Sign in

Compare 476 IP from 70 vendors (1 - 10)
  • USB 4.0 - Enables fast data transfer, efficient power delivery, and connectivity
    • USB 4.0 is the third major revision of the USB standard, offering data transfer speeds up to 20 Gbps via dual-lane operation. It supports multiple transfer modes and improved bandwidth utilization for high-speed applications.
    • USB 4.0 enables seamless connectivity across various devices, from storage and printers to high-performance audio and video equipment. It enhances power delivery and ensures efficient data transfer for consumer electronics, networking, and industrial applications.
    Block Diagram -- USB 4.0 - Enables fast data transfer, efficient power delivery, and connectivity
  • UCLe - Ensures reliable validation and efficient connectivity for chiplets
    • UCIe VIP is a state-of-the-art solution for validating and ensuring compliance in multi-chip semiconductor systems. With features like high-speed data transfer, protocol compliance, and advanced debugging, it guarantees robust and efficient chiplet communication.
    • This technology powers diverse applications, including HPC, AI/ML, automotive electronics, and telecommunications. It ensures seamless data flow, reliability, and energy efficiency across industries like edge computing, cloud platforms, and consumer electronics
    Block Diagram -- UCLe - Ensures reliable validation and efficient connectivity for chiplets
  • Magillem Connectivity System Integration Automation
    • Project management: Design navigation and data aggregation
    • HDL import: Automatic import of structural RTL into a valid IP-XACT design with the support of SystemVerilog, Verilog, and VHDL languages
    • IP Packaging: Aggregate component information from different sources in a structured and standard-based format for several design tasks and teams (automatic mapping of bus interfaces, specification of the views with complete fileSet for various skills)
    • SoC assembly: Powerful rule-based connectivity, bus interface detection, bus/signal split/tie/open, hierarchical connection, glue logic insertion, feedthrough
    Block Diagram -- Magillem Connectivity System Integration Automation
  • 112G-VSR PAM4 SerDes PHY - PPA optimized for short reach connectivity
    • 1.25Gbps to 116Gbps flexible data rates allowing simultaneous support of different protocols including Ethernet and OTN
    • Power optimized for short-reach applications with configurability
    • Superior bit error rate (BER) with extra performance margin beyond short-reach standard requirements
    • Beachfront optimized floorplan allows north-south and east-west SoC edge placement
    • Comprehensive on-chip diagnostic features make system testing and debugging quick and easy
    • Enables 800Gbps networking with PHY and Controller solutions
    Block Diagram -- 112G-VSR PAM4 SerDes PHY - PPA optimized for short reach connectivity
  • Bluetooth Connectivity Platform
    • The Ceva-Waves Bluetooth platform comprises a comprehensive set of hardware IP, software modules, and radios from Ceva and third-party partners addressing a broad choice of processes and nodes, to implement highly efficient Bluetooth connectivity in SoCs.
    • The latest Bluetooth standards, both Bluetooth LE and dual-mode versions are supported, and an available add-in extends support to IEEE 802.15.4.
    Block Diagram -- Bluetooth Connectivity Platform
  • Wi-Fi Connectivity Platform
    • The Ceva-Waves Wi-Fi platforms portfolio provide a comprehensive selection of hardware IP and CPU-agnostic host software for energy-efficient SoC implementation of any of a wide range of Wi-Fi subsystems, from Wi-Fi 4 to Wi-Fi 7, for both client devices and access points.
    • The portfolio includes a suite of pre-optimized solutions for various generations and configurations for specific Wi-Fi uses, power consumption levels, and price points, ranging from low-bandwidth IoT connectivity to high-bandwidth hubs.
    Block Diagram -- Wi-Fi Connectivity Platform
  • Low Power BTDM5.3 Connectivity Transceiver
    • Compliant to Bluetooth core specification 5
    • Supports Bluetooth basic rate (BR), enhanced data rate (EDR) and low energy (LE)
    • Low power consumption
    • Low-cost BOM
    Block Diagram -- Low Power BTDM5.3 Connectivity Transceiver
  • NVMe over TCP IP core - End-to-End NVMe-oF TCP connectivity with no CPU!
    • NVMeTCP IP is the standalone host side NVMe Over Fabric (NVMe/TCP) controller with no CPU and external memory required. Enabling very high-performance remote access to NVMe-oF Storage Server by simple user logic.
    • Greatly reduce design complexity and development time. Allowing your FPGA Card/Board to get access to the existing NVMe-oF storage infrastructure remotely and directly over FPGA’s network interface with maximum possible performance.
    Block Diagram -- NVMe over TCP IP core - End-to-End NVMe-oF TCP connectivity with no CPU!
  • AXI Interconnect
    • The AXI MATRIX-IP component is a multi-layer interconnect implementation of the AXI protocol, which is designed for high-performance, high-frequency system designs.
    • AXI MATRIX-IP is highly configurable with the capacity to handle up to 16 Masters and Slaves. IP can be configured to support AXI3, AXI4-Lite or AXI4
    Block Diagram -- AXI Interconnect
  • HDMI - Ensures seamless video and audio transmission with HDMI standards
    • HDMI Verification IP validates HDMI controller functionality in SoC designs, ensuring compliance with HDMI standards like 1.4, 2.0, and 2.1. It verifies video/audio signal transmission, encryption, and data integrity for smooth multimedia experience.
    • The VIP also tests advanced features like 3D video, HDR, and deep color formats, ensuring compatibility across various devices. It simulates scenarios like hot-plug detection and HDCP for secure, error-free content transmission in diverse real-world applications.
    Block Diagram -- HDMI - Ensures seamless video and audio transmission with HDMI standards
×
Semiconductor IP