Connectivity IP

USB 4.0 is the third major revision of the USB standard, offering data transfer speeds up to 20 Gbps via dual-lane operation. It supports multiple transfer modes and improved bandwidth utilization for high-speed applications.
USB 4.0 enables seamless connectivity across various devices, from storage and printers to high-performance audio and video equipment. It enhances power delivery and ensures efficient data transfer for consumer electronics, networking, and industrial applications.

UCIe VIP is a state-of-the-art solution for validating and ensuring compliance in multi-chip semiconductor systems. With features like high-speed data transfer, protocol compliance, and advanced debugging, it guarantees robust and efficient chiplet communication.
This technology powers diverse applications, including HPC, AI/ML, automotive electronics, and telecommunications. It ensures seamless data flow, reliability, and energy efficiency across industries like edge computing, cloud platforms, and consumer electronics

Project management: Design navigation and data aggregation
HDL import: Automatic import of structural RTL into a valid IP-XACT design with the support of SystemVerilog, Verilog, and VHDL languages
IP Packaging: Aggregate component information from different sources in a structured and standard-based format for several design tasks and teams (automatic mapping of bus interfaces, specification of the views with complete fileSet for various skills)
SoC assembly: Powerful rule-based connectivity, bus interface detection, bus/signal split/tie/open, hierarchical connection, glue logic insertion, feedthrough

1.25Gbps to 116Gbps flexible data rates allowing simultaneous support of different protocols including Ethernet and OTN
Power optimized for short-reach applications with configurability
Superior bit error rate (BER) with extra performance margin beyond short-reach standard requirements
Beachfront optimized floorplan allows north-south and east-west SoC edge placement
Comprehensive on-chip diagnostic features make system testing and debugging quick and easy
Enables 800Gbps networking with PHY and Controller solutions

The Ceva-Waves Bluetooth platform comprises a comprehensive set of hardware IP, software modules, and radios from Ceva and third-party partners addressing a broad choice of processes and nodes, to implement highly efficient Bluetooth connectivity in SoCs.
The latest Bluetooth standards, both Bluetooth LE and dual-mode versions are supported, and an available add-in extends support to IEEE 802.15.4.

The Ceva-Waves Wi-Fi platforms portfolio provide a comprehensive selection of hardware IP and CPU-agnostic host software for energy-efficient SoC implementation of any of a wide range of Wi-Fi subsystems, from Wi-Fi 4 to Wi-Fi 7, for both client devices and access points.
The portfolio includes a suite of pre-optimized solutions for various generations and configurations for specific Wi-Fi uses, power consumption levels, and price points, ranging from low-bandwidth IoT connectivity to high-bandwidth hubs.

Compliant to Bluetooth core specification 5
Supports Bluetooth basic rate (BR), enhanced data rate (EDR) and low energy (LE)
Low power consumption
Low-cost BOM

NVMeTCP IP is the standalone host side NVMe Over Fabric (NVMe/TCP) controller with no CPU and external memory required. Enabling very high-performance remote access to NVMe-oF Storage Server by simple user logic.
Greatly reduce design complexity and development time. Allowing your FPGA Card/Board to get access to the existing NVMe-oF storage infrastructure remotely and directly over FPGA’s network interface with maximum possible performance.

Compliant with the UCIe specification (2.0 & 1.1)
Flexible Structure, easy to customize (Pre-hardened PHY tuned to Customer Spec, PHY + Adapter Layer, PHY + Adapter Layer + Customized Protocol Layer)
Supports the CXS/AXI using the streaming package (AXI Interface bandwidth up to 89%)

The MIPI D-PHY + DSI/CSI Controller IP is a versatile solution designed for high-speed data transmission in mobile and multimedia applications
It supports MIPI D-PHY 2.0 standards
The IP features a compact design with built-in I/O and ESD protection, optimized for robust performance and low power consumption
It enables seamless connectivity with D-PHY based sensors, making it ideal for SoCs in consumer electronics, automotive, and IoT devices

connectivity IP