UCIe PHY IP

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Compare 48 IP from 12 vendors (1 - 10)
  • UCIe PHY & D2D Adapter
    • 32Gbps UCIe-Advanced (UCIe-A) & Standard (UCIe-S)
    • UCIe v1.1 specification
    Block Diagram -- UCIe PHY & D2D Adapter
  • 2-16Gbps Multi-Protocol IO Supporting BOW, OHBI and UCIe
    • High Bandwidth Density and Data Rates
    • Package Configurability
    • Energy Efficiency
    • Fully Integrated Solution
    Block Diagram -- 2-16Gbps Multi-Protocol IO Supporting BOW, OHBI and UCIe
  • UCIe and BOW Universal PHY
    • Novel Redundancy for Hi-Rel,
    • Support for 16&18-bit wide data,
    • Support Synchronous Operation,
    • Supports Advanced packaging,
    Block Diagram -- UCIe and BOW Universal PHY
  • Universal Chiplet Interconnect Express(UCIe) VIP
    • The UCIe VIP , a state-of-the-art solution that offers a comprehensive set of features and capabilities to ensure the quality and performance of your UCIe designs
    • The UCIe VIP is fully compliant with UCIe Specification version 1.0 and supports all the layers of the UCIe stack, such as FDI, RDI, LogPHY, PCIe, and CXL protocols
    • The UCIe VIP is also very user-friendly and flexible, with simple APIs, easy integrations, and configurable parameters
    Block Diagram -- Universal Chiplet Interconnect Express(UCIe) VIP
  • The UCIe CONTROLLER IP
    • The UCIe IP solution includes D2D Adapter layer which supports streaming/PCIe/CXL/Raw flitformats, supports both standard and advanced mainband links and sideband links
    Block Diagram -- The UCIe CONTROLLER IP
  • UCIe D2D Adapter
    • The D2D Adapter for UCIe is a scalable adapter layer between one or more protocol components and the UCIe PHY, which ensures efficient data transfer across the UCIe Link by seamlessly coordinating with the Protocol Layer and Physical Layer.
    • By minimizing logic on the main data path, it delivers a low-latency, optimized pathway for protocol Flits.
    Block Diagram -- UCIe D2D Adapter
  • Simulation VIP for UCIE
    • Protocol Layer Features
    • Streaming mode
    • PCIe mode
    • Protocol FDI LSMs
    Block Diagram -- Simulation VIP for UCIE
  • IPTD2D-A PHY and Controller
    • Supports CoWoSTM, INFOTM and EMIBTM package technologies
    • Supports any speed ranging from 2Gbps to 16Gbps, achieving the best balance between total bandwidth and power consumption
  • UCIe-S PHY and Controller
    • Supports MCM, BGA packages and Chiplet2Chiplet interconnects on PCB
    • Available process nodes: 28, 22, 16, 12, 7, 6nm
    • X16 and X32 PHY with bump maps defined in UCIe 2.0 specifications
    • Industry leading power consumption
  • UCIe-S PHY for Standard Package (x16) in TSMC N6, North/South Orientation
    • Supports data rates up to 40Gb/s and bandwidth density of 12.9Tbps/mm
    • Compliant with the latest UCIe specification
    • Integrated signal integrity monitors and comprehensive test and repair features
    • Supports high-density advanced packaging technologies such as silicon interposer, silicon bridge, and RDL fanout
    Block Diagram -- UCIe-S PHY for Standard Package (x16) in TSMC N6, North/South Orientation
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Semiconductor IP