"Zero Power" IQ Direct Conversion Modulator-Demodulator

Overview

ZiPMOD is a direct conversion quadrature modulator-demodulator designed for ultra-low power communication systems. The device is broad-band, requiring “zero” DC power, while maintaining superior linearity.

Benefits of the component include excellent amplitude and phase balance, low conversion loss and low noise figure. Intermodulation products IM2 and IM3 can be adjusted. RF, LO and baseband interfaces are fully differential. The baseband outputs of the device interface directly to baseband amplifiers or low-pass filters.

The excellent linearity of the ZiPMOD direct conversion quadrature demodulator will improve receiver dynamic range and significantly reduce size and cost by eliminating the need for IF signal processing components.

Performance as a modulator is equally impressive. Excellent sideband suppression and carrier leakage are achievable without adjustment.

Clock inputs are logic level pulses operating at the on-channel RF frequency. Maximum performance is achievable when coupled with ParkerVision’s quadrature sampling clock pulse generator. Contact ParkerVision for more information.

Key Features

  • “Zero” power consumption
  • Operating RF Frequency: < 50MHz to > 5GHz
  • IQ Demodulator
    • High Linearity:
      • IP1dB +4.5dBm
      • IIP3 +11dBm, IIP2 +70dBm (customizable)
    • Low insertion loss: 3dB @ 2450MHz
    • Noise Figure: 3.3dB @ 2450MHz
    • Input return loss: -12dB
    • Phase Accuracy: 1° typical
    • Amplitude imbalance: 0.05dB typical
  • IQ Modulator
    • Carrier Leakage: - 40dBm @ 2450MHz
    • OIP3: +18dBm @ 2450MHz (customizable)
    • Sideband Suppression: -45dBc
    • Output return loss: -15dB

Benefits

  • “Zero” power consumption
  • Fast delivery time
  • "Silicon-Any"...Any CMOS or SiGe process
  • Can be implemented in fab and node of your choice

Applications

  • Bluetooth Low Energy (BLE)
  • Internet of Things (IOT)
  • RF-Identification (RFID)
  • Wearables
  • General Purpose ISM Band Applications
  • Broadband Wireless, Infrastructure

Deliverables

  • Datasheet
  • Netlist (CDL)
  • Layout View (GDS2)
  • Abstract View (LEF)
  • Verification Report 1
  • Test Bench with Configurations 1
  • Integration Support
  • Note 1: These services are optional upon customer request

Technical Specifications

Foundry, Node
Any CMOS or SiGe process node
Maturity
Pre-silicon
Availability
30 days
×
Semiconductor IP