MIPI DSI-2 DSC RX IP

Overview

Innosilicon MIPI DSI-2 DSC RX IP implements the MIPI C/D-PHY as well as MIPI DSI-2 protocols and contains the DSC (Display Stream Compression) algorithm defined by VESA. The DSI-2 link protocol specification is a part of group of communication protocols defined by MIPI® Alliance, which is intended for mobile system chip to chip communications. The MIPI DSI-2 specification is specifically targeted for the display communications in image application processors.
Innosilicon MIPI DSI-2 DSC RX operates as a receiver of a DSI-2 link, which consists of a MIPI C/D combo PHY, a DSI-2 controller, and a DSC decoder.
? The MIPI C/D combo PHY is used for the data transmission from a DSI-2 compliant display module. In C/D combo PHY, data streams are organized as packets. Error information is generated for the application layer to do further operation.
? The DSI-2 controller works as a protocol layer between the application layer and physical layer, which aims to reconstruct the data streams from the C/D-PHY. Innosilicon DSI-2 controller implements all three layers defined by DSI-2 specification, including Pixel/Byte Packing, Low Level Protocol, and Lane Management.
? The DSC decoder algorithm is a visually lossless compression algorithm with a compression ratio of up to 3:1. The DSC algorithm enables low-cost hardware implementations of visually lossless video compression over display links.

Key Features

  • Compliant with MIPI® Alliance Specification for Display Serial Interface (DSI-2) V1.0
  • Compliant with MIPI® Alliance Specification for C-PHY V1.1
  • Compliant with MIPI® Alliance Specification for D-PHY V1.2
  • Compliant with MIPI® Alliance Specification for Display Command Set (DCS) V1.3
  • Compliant with AMBA 3.0 APB Specification
  • Compliant with VESA Display Stream Compression (DSC) Standard V1.1
  • Data transfer rate ranging from 450Msps to 2.5Gsps per trio (C-PHY)
  • Data transfer rate ranging from 400Mbps to 2.5Gbps per lane (D-PHY)
  • Supports Pixel Interface and Packet Interface
  • Supports data type: RGB/YCbCr (based on actual application scenarios)
  • Asynchronous transfer at low power mode with a bit rate of 10 Mbps on both C-PHY and D-PHY
  • Supports HS, LP, and ULPS modes
  • Supports Skew-Calibration for D-PHY
  • Bidirectional communication and escape mode support through data lane 0
  • Automatic termination control for HS and LP modes
  • Supports compression ratios of 3:1 and 2:1 for RGB

Deliverables

  • Databook and detailed physical implementation guides for the complete PHY
  • Library Exchange Format (LEF) file with pin size and locations
  • Gate-level netlist and Standard Delay Format (SDF) Timing file
  • Layout Versus Schematic (LVS) flattened netlist in spice format and report
  • Encrypted Verilog Models
  • GDSII database for foundry merge
  • Module integration guidelines
  • Silicon validation report (when available)
  • Evaluation board (when available)

Technical Specifications

Foundry, Node
TSMC 12nm, SMIC 40/28nm
SMIC
In Production: 28nm , 40nm LL
Silicon Proven: 28nm , 40nm LL
TSMC
In Production: 12nm
Silicon Proven: 12nm
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Semiconductor IP