Lightweight die-to-die interconnect solution optimized for highest performance with the lowest power and area overhead
Die-to-Die (D2D) Interconnect
Overview
Key Features
- Adaptable to any communication protocols including extending SkyeChip’s Non-Coherent and Coherent NOC interconnects across multiple dies
- Architected to significantly reduce wiring overhead across multiple dies
- Supports transfer rates of up to 6.4GT/s
- Supports major 2.5D and 3D inter-die packaging technologies